5秒后页面跳转
捷配首页

Datasheet > 暂无类别数据> SN74LVC1G27YZPR
SN74LVC1G27YZPR PDF预览

SN74LVC1G27YZPR

更新时间： 2024-11-04 23:11:03
品牌 Logo 应用领域
德州仪器 - TI 输入元件
页数 文件大小 规格书
12页 235K
描述
SINGLE 3-INPUT POSITIVE-NOR GATE

阅读下载

中文翻译

获取价格

SN74LVC1G27YZPR 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Active零件包装代码：BGA
包装说明：VFBGA, BGA6,2X3,20针数：6
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8542.39.00.01Factory Lead Time：1 week
风险等级：1.47系列：LVC/LCX/Z
JESD-30 代码：R-XBGA-B6JESD-609代码：e1
长度：1.4 mm负载电容（CL）：50 pF
逻辑集成电路类型：NOR GATE最大I（ol）：0.032 A
湿度敏感等级：1功能数量：1
输入次数：3端子数量：6
最高工作温度：85 °C最低工作温度：-40 °C
输出特性：3-STATE封装主体材料：UNSPECIFIED
封装代码：VFBGA封装等效代码：BGA6,2X3,20
封装形状：RECTANGULAR封装形式：GRID ARRAY, VERY THIN PROFILE, FINE PITCH
包装方法：TR峰值回流温度（摄氏度）：260
电源：3.3 V最大电源电流（ICC）：0.01 mA
Prop。Delay @ Nom-Sup：5.4 ns传播延迟（tpd）：20.5 ns
认证状态：Not Qualified施密特触发器：NO
座面最大高度：0.5 mm子类别：Gates
最大供电电压 (Vsup)：5.5 V最小供电电压 (Vsup)：1.65 V
标称供电电压 (Vsup)：1.8 V表面贴装：YES
技术：CMOS温度等级：INDUSTRIAL
端子面层：Tin/Silver/Copper (Sn/Ag/Cu)端子形式：BALL
端子节距：0.5 mm端子位置：BOTTOM
处于峰值回流温度下的最长时间：NOT SPECIFIED宽度：0.9 mm
Base Number Matches：1

SN74LVC1G27YZPR 数据手册

 浏览型号SN74LVC1G27YZPR的Datasheet PDF文件第2页浏览型号SN74LVC1G27YZPR的Datasheet PDF文件第3页浏览型号SN74LVC1G27YZPR的Datasheet PDF文件第4页浏览型号SN74LVC1G27YZPR的Datasheet PDF文件第5页浏览型号SN74LVC1G27YZPR的Datasheet PDF文件第6页浏览型号SN74LVC1G27YZPR的Datasheet PDF文件第7页 
SN74LVC1G27  
SINGLE 3-INPUT POSITIVE-NOR GATE  
www.ti.com  
SCES488B–SEPTEMBER 2003–REVISED MARCH 2005  
FEATURES  
DBV OR DCK PACKAGE  
(TOP VIEW)  
•
Available in the Texas Instruments  
NanoStar™ and NanoFree™ Packages  
1
2
3
6
5
4
A
GND  
B
C
•
•
•
•
•
•
Supports 5-V VCC Operation  
V
Y
CC  
Inputs Accept Voltages to 5.5 V  
Max tpd of 4.5 ns at 3.3 V  
Low Power Consumption, 10-µA Max ICC  
±24-mA Output Drive at 3.3 V  
YEP OR YZP PACKAGE  
(BOTTOM VIEW)  
Ioff Supports Partial-Power-Down Mode  
Operation  
3
2
1
4
5
6
B
GND  
A
Y
V
CC  
•
•
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
C
ESD Protection Exceeds JESD 22  
– 2000-V Human-Body Model (A114-A)  
– 200-V Machine Model (A115-A)  
– 1000-V Charged-Device Model (C101)  
DESCRIPTION/ORDERING INFORMATION  
The SN74LVC1G27 performs the Boolean function Y = A + B + C or Y = A B C in positive logic.  
NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the  
die as the package.  
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,  
preventing damaging current backflow through the device when it is powered down.  
ORDERING INFORMATION  
TA  
PACKAGE(1)  
NanoStar™ – WCSP (DSBGA)  
ORDERABLE PART NUMBER  
TOP-SIDE MARKING(2)  
SN74LVC1G27YEPR  
0.23-mm Large Bump – YEP  
Tape and reel  
_ _ _CU_  
NanoFree™ – WCSP (DSBGA)  
0.23-mm Large Bump – YZP  
(Pb-free)  
SN74LVC1G27YZPR  
–40°C to 85°C  
SOT (SOT-23) – DBV  
SOT (SC-70) – DCK  
Tape and reel  
Tape and reel  
SN74LVC1G27DBVR  
SN74LVC1G27DCKR  
C27_  
CU_  
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
(2) DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.  
YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following  
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition  
(1 = SnPb, = Pb-free).  
FUNCTION TABLE  
INPUTS  
OUTPUT  
Y
A
H
X
X
L
B
X
H
X
L
C
X
X
H
L
L
L
L
H
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NanoStar, NanoFree are trademarks of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2003–2005, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
1234567...12

中文翻译

下载PDF

与SN74LVC1G27YZPR相关器件

型号 品牌 获取价格 描述 数据表
SN74LVC1G29 TI

获取价格

 		2-OF-3 DECODER/DEMULTIPLEXER
SN74LVC1G29DCTR TI

获取价格

 		2-OF-3 DECODER/DEMULTIPLEXER
SN74LVC1G29DCTRE4 TI

获取价格

 		2-OF-3 DECODER/DEMULTIPLEXER
SN74LVC1G29DCTRG4 TI

获取价格

 		LVC/LCX/Z SERIES, OTHER DECODER/DRIVER, INVERTED OUTPUT, PDSO8, GREEN, PLASTIC, SSOP-8
SN74LVC1G29DCTT TI

获取价格

 		2-OF-3 DECODER/DEMULTIPLEXER
SN74LVC1G29DCUR TI

获取价格

 		2-OF-3 DECODER/DEMULTIPLEXER
SN74LVC1G29DCURE4 TI

获取价格

 		2-OF-3 DECODER/DEMULTIPLEXER
SN74LVC1G29DCURG4 TI

获取价格

 		LVC/LCX/Z SERIES, OTHER DECODER/DRIVER, INVERTED OUTPUT, PDSO8, GREEN, PLASTIC, VSSOP-8
SN74LVC1G29DCUT TI

获取价格

 		2-OF-3 DECODER/DEMULTIPLEXER
SN74LVC1G29DCUTE4 TI

获取价格

 		2-OF-3 DECODER/DEMULTIPLEXER

与SN74LVC1G27YZPR相关文章

您还可以找


热门产品
PCB打样/小批量
铝基板
BOM智能配单
PCBA制造
钣金
精密CNC
模具注塑
薄膜开关
精选活动
PCBA打样特惠
四六层板品质升级
铝基板品质升级
一体化电子制造
DFM下载
服务支持
企业认证
产品展示
工厂展示
工艺能力
积分商城
关于捷配
捷配简介
企业文化
公司动态
人才招聘
联系我们
帮助中心
下单流程
付款流程
开票流程
常见问题
全球PCB制造服务专线 400-613-0088

工作时间：9:00-21:00

CEO邮箱：ceo@jiepei.com

投诉邮箱：tousu@jiepei.com

捷配网-微信公众号 微信公众号
捷配网-微信公众号 抖音公众号
资质认证：
合作快递：
支付方式：
Copyright © 2024 Jiepei.com Inc. All Rights Reserved. 版权所有:杭州捷配信息科技有限公司 浙公网安备 33010502006866号 浙ICP备10014259号-119 营业执照ICP证