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SN74LVC1G29 PDF预览

SN74LVC1G29

更新时间： 2024-09-15 05:29:35
品牌 Logo 应用领域
德州仪器 - TI 解码器解复用器
页数 文件大小 规格书
14页 325K
描述
2-OF-3 DECODER/DEMULTIPLEXER

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SN74LVC1G29 数据手册

 浏览型号SN74LVC1G29的Datasheet PDF文件第2页浏览型号SN74LVC1G29的Datasheet PDF文件第3页浏览型号SN74LVC1G29的Datasheet PDF文件第4页浏览型号SN74LVC1G29的Datasheet PDF文件第5页浏览型号SN74LVC1G29的Datasheet PDF文件第6页浏览型号SN74LVC1G29的Datasheet PDF文件第7页 
SN74LVC1G29  
2-OF-3 DECODER/DEMULTIPLEXER  
www.ti.com  
SCES569A–JUNE 2004–REVISED SEPTEMBER 2006  
FEATURES  
•
Available in the Texas Instruments  
NanoStar™ and NanoFree™ Packages  
•
•
•
Ioff Supports Partial-Power-Down Mode  
Operation  
•
•
•
•
•
•
Supports 5-V VCC Operation  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
Inputs Accept Voltages to 5.5 V  
Max tpd of 5.1 ns at 3.3 V  
ESD Protection Exceeds JESD 22  
– 2000-V Human-Body Model (A114-A)  
– 200-V Machine Model (A115-A)  
Low Power Consumption, 10-µA Max ICC  
±24-mA Output Drive at 3.3 V  
– 1000-V Charged-Device Model (C101)  
Typical VOLP (Output Ground Bounce) <0.8 V  
at VCC = 3.3 V, TA = 25°C  
•
Typical VOHV (Output VOH Undershoot) >2 V at  
VCC = 3.3 V, TA = 25°C  
DCT PACKAGE  
(TOP VIEW)  
DCU PACKAGE  
(TOP VIEW)  
YEP OR YZP PACKAGE  
(BOTTOM VIEW)  
4 5  
GND  
A0  
Y2  
A1  
VCC  
Y0  
A1  
Y2  
1
2
3
4
8
7
6
5
G
Y1  
VCC  
Y0  
A1  
Y2  
1
2
3
4
8
7
6
5
G
Y1  
3 6  
2 7  
1 8  
Y1  
Y0  
A0  
VCC  
G
GND  
A0  
GND  
See mechanical drawings for dimensions.  
DESCRIPTION/ORDERING INFORMATION  
This decoder is designed for 1.65-V to 5.5-V VCC operation.  
The SN74LVC1G29 is a 2-of-3 decoder/demultiplexer. When the enable (G) input signal is low, only one of the  
outputs is in the low state, depending on the input levels of A0 and A1. When G is high, Y0, Y1, and Y2 are  
high, regardless of the input states.  
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disable the outputs,  
preventing damaging current backflow through the device when it is powered down.  
NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the  
die as the package.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NanoStar, NanoFree are trademarks of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2004–2006, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
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