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SN74LVC1G3157YZPR PDF预览

SN74LVC1G3157YZPR

更新时间： 2024-11-05 22:06:39
品牌 Logo 应用领域
德州仪器 - TI 开关光电二极管
页数 文件大小 规格书
16页 312K
描述
SINGLE-POLE, DOUBLE-THROW ANALOG SWITCH

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SN74LVC1G3157YZPR 数据手册

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SN74LVC1G3157  
SINGLE-POLE, DOUBLE-THROW ANALOG SWITCH  
SCES424C – JANUARY 2003 - REVISED SEPTEMBER 2003  
DBV OR DCK PACKAGE  
(TOP VIEW)  
1.65-V to 5.5-V V  
Operation  
CC  
Useful for Both Analog and Digital  
Applications  
1
2
3
6
5
4
B2  
GND  
B1  
S
V
A
Specified Break-Before-Make Switching  
Rail-to-Rail Signal Handling  
High Degree of Linearity  
CC  
High Speed, Typically 0.5 ns  
YEP OR YZP PACKAGE  
(BOTTOM VIEW)  
(V  
= 3 V, C = 50 pF)  
CC  
L
Low On-State Resistance, Typically ≈6 Ω  
(V = 4.5 V)  
3 4  
2 5  
1 6  
B1  
GND  
B2  
A
V
S
CC  
CC  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
ESD Protection Exceeds JESD 22  
– 2000-V Human-Body Model (A114-A)  
– 200-V Machine Model (A115-A)  
– 1000-V Charged-Device Model (C101)  
description/ordering information  
This single-pole, double-throw (SPDT) analog switch is designed for 1.65-V to 5.5-V V  
operation.  
CC  
The SN74LVC1G3157 can handle both analog and digital signals. The device permits signals with amplitudes  
of up to V (peak) to be transmitted in either direction.  
CC  
Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for  
analog-to-digital and digital-to-analog conversion systems.  
ORDERING INFORMATION  
ORDERABLE  
PART NUMBER  
TOP-SIDE  
MARKING  
†
T
A
PACKAGE  
‡
NanoStar– WCSP (DSBGA)  
0.23-mm Large Bump – YEP  
SN74LVC1G3157YEPR  
SN74LVC1G3157YZPR  
Tape and reel  
_ _ _C5_  
NanoFree– WCSP (DSBGA)  
0.23-mm Large Bump – YZP (Pb-free)  
–40°C to 85°C  
SOT (SOT-23) – DBV  
Tape and reel  
Tape and reel  
SN74LVC1G3157DBVR  
SN74LVC1G3157DCKR  
CC5_  
C5_  
SOT (SC-70) – DCK  
†
‡
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.  
YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one  
following character to designate the assembly/test site. Pin  
1 identifier indicates solder-bump composition  
(1 = SnPb, • = Pb-free).  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
Copyright 2003, Texas Instruments Incorporated  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265  
1234567...16

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SN74LVC1G3157YZPR 替代型号

型号 品牌 替代类型 描述 数据表
SN74LVC1G3157DCKR TI

完全替代

 SINGLE-POLE, DOUBLE-THROW ANALOG SWITCH
SN74LVC1G3157DBVR TI

完全替代

 SINGLE-POLE, DOUBLE-THROW ANALOG SWITCH
74LVC1G3157DBVRE4 TI

类似代替

 SINGLE-POLE,DOUBLE-THROW ANALOG SWITCH

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