SN74LVC1G27
SINGLE 3-INPUT POSITIVE-NOR GATE
www.ti.com
SCES488B–SEPTEMBER 2003–REVISED MARCH 2005
FEATURES
DBV OR DCK PACKAGE
(TOP VIEW)
•
Available in the Texas Instruments
NanoStar™ and NanoFree™ Packages
1
2
3
6
5
4
A
GND
B
C
•
•
•
•
•
•
Supports 5-V VCC Operation
V
Y
CC
Inputs Accept Voltages to 5.5 V
Max tpd of 4.5 ns at 3.3 V
Low Power Consumption, 10-µA Max ICC
±24-mA Output Drive at 3.3 V
YEP OR YZP PACKAGE
(BOTTOM VIEW)
Ioff Supports Partial-Power-Down Mode
Operation
3
2
1
4
5
6
B
GND
A
Y
V
CC
•
•
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
C
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
DESCRIPTION/ORDERING INFORMATION
The SN74LVC1G27 performs the Boolean function Y = A + B + C or Y = A B C in positive logic.
NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the
die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION
TA
PACKAGE(1)
NanoStar™ – WCSP (DSBGA)
ORDERABLE PART NUMBER
TOP-SIDE MARKING(2)
SN74LVC1G27YEPR
0.23-mm Large Bump – YEP
Tape and reel
_ _ _CU_
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP
(Pb-free)
SN74LVC1G27YZPR
–40°C to 85°C
SOT (SOT-23) – DBV
SOT (SC-70) – DCK
Tape and reel
Tape and reel
SN74LVC1G27DBVR
SN74LVC1G27DCKR
C27_
CU_
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition
(1 = SnPb, = Pb-free).
FUNCTION TABLE
INPUTS
OUTPUT
Y
A
H
X
X
L
B
X
H
X
L
C
X
X
H
L
L
L
L
H
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar, NanoFree are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 2003–2005, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.