SKM150GAR12V
Absolute Maximum Ratings
Symbol Conditions
IGBT
Values
Unit
Tj = 25 °C
VCES
IC
1200
231
176
150
450
V
A
A
A
A
V
Tc = 25 °C
Tc = 80 °C
Tj = 175 °C
ICnom
ICRM
VGES
ICRM = 3 xICnom
VCC = 720 V
-20 ... 20
SEMITRANS® 2
V
V
GE ≤ 15 V
CES ≤ 1200 V
Tj = 125 °C
tpsc
10
µs
°C
Tj
-40 ... 175
Inverse diode
Tc = 25 °C
Tc = 80 °C
IF
189
141
150
450
900
A
A
A
A
A
Tj = 175 °C
SKM150GAR12V
Features
IFnom
IFRM
IFSM
Tj
IFRM = 3xIFnom
tp = 10 ms, sin 180°, Tj = 25 °C
• V-IGBT = 6. Generation Trench V-IGBT
(Fuji)
-40 ... 175
°C
Freewheeling diode
IF
• CAL4 = Soft switching 4. Generation
CAL-diode
Tc = 25 °C
Tc = 80 °C
189
141
150
450
900
A
A
A
A
A
Tj = 175 °C
• Insulated copper baseplate using DBC
technology (Direct Copper Bonding)
• Increased power cycling capability
• With integrated gate resistor
• UL recognized, file no. E63532
• Lowest switching losses at High di/dt
IFnom
IFRM
IFSM
Tj
IFRM = 3xIFnom
tp = 10 ms, sin 180°, Tj = 25 °C
AC sinus 50 Hz, t = 1 min
-40 ... 175
°C
Typical Applications*
Module
It(RMS)
Tstg
• Electronic welders
• DC/DC – converter
• Brake chopper
200
-40 ... 125
4000
A
°C
V
Visol
• Switched reluctance motor
Remarks
Characteristics
• Case temperature limited to Tc = 125°C
max.
Symbol Conditions
IGBT
min.
typ.
max.
Unit
• Recommended Top = -40 ... +150°C
• Product reliability results valid for Tj =
150°C
IC = 150 A
Tj = 25 °C
VCE(sat)
1.75
2.20
2.20
2.48
V
V
V
GE = 15 V
Tj = 150 °C
chiplevel
Tj = 25 °C
Tj = 150 °C
Tj = 25 °C
Tj = 150 °C
VCE0
rCE
0.94
0.88
5.4
8.8
6
1.04
0.98
7.7
10
6.5
0.3
V
V
mΩ
mΩ
V
mA
mA
nF
nF
nF
nC
Ω
chiplevel
VGE = 15 V
chiplevel
VGE(th)
ICES
VGE=VCE, IC = 6 mA
VGE = 0 V
5.5
Tj = 25 °C
Tj = 150 °C
f = 1 MHz
f = 1 MHz
f = 1 MHz
V
CE = 1200 V
-
Cies
Coes
Cres
QG
9.0
VCE = 25 V
GE = 0 V
0.89
0.88
1650
5.0
V
VGE = - 8 V...+ 15 V
Tj = 25 °C
RGint
GAR
© by SEMIKRON
Rev. 1.0 – 31.01.2019
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