SKM150GB12F4
Absolute Maximum Ratings
Symbol Conditions
IGBT
Values
Unit
Tj = 25 °C
VCES
IC
1200
201
153
150
300
V
A
A
A
A
V
Tc = 25 °C
Tc = 80 °C
Tj = 175 °C
ICnom
ICRM
VGES
-20 ... 20
SEMITRANS® 2
High Speed IGBT4 Modules
SKM150GB12F4
VCC = 800 V
V
V
GE ≤ 15 V
Tj = 150 °C
tpsc
10
µs
°C
CES ≤ 1200 V
R
G on/off ≥ 2.7 Ω
Tj
Inverse diode
Tj = 25 °C
-40 ... 175
VRRM
IF
1200
174
128
V
A
A
Tc = 25 °C
Tc = 80 °C
Tj = 175 °C
Features*
• High speed trench and field-stop IGBT
• CAL4 ultra-fast = soft switching 4.
generation CAL-diode
IFRM
IFSM
Tj
300
774
-40 ... 175
A
A
°C
tp = 10 ms, sin 180°, Tj = 25 °C
Module
It(RMS)
Tstg
• Insulated copper baseplate using DBC
technology (Direct Bonded Copper)
• Increased power cycling capability
• For higher switching frequencies above
15kHz
200
-40 ... 125
4000
A
°C
V
module without TIM
AC sinus 50 Hz, t = 1 min
Visol
• UL recognized, file no. E63532
Characteristics
Symbol Conditions
IGBT
Typical Applications
• UPS
• Electronic welders
• Inductive heating
• Switched mode power supplies
min.
typ.
max.
Unit
IC = 150 A
Tj = 25 °C
VCE(sat)
2.05
2.60
2.42
2.93
V
V
V
GE = 15 V
Tj = 150 °C
chiplevel
Remarks
• Case temperature limited
to Tc = 125°C max.
• Recommended Top = -40 ... +150°C
• Product reliability results valid
for Tj = 150°C
Tj = 25 °C
Tj = 150 °C
Tj = 25 °C
Tj = 150 °C
VCE0
rCE
1.10
0.95
6.3
11
5.8
1.28
1.13
7.6
12
6.4
2.0
V
V
mΩ
mΩ
V
mA
nF
nF
nF
nC
Ω
ns
ns
mJ
ns
ns
chiplevel
VGE = 15 V
chiplevel
VGE(th)
ICES
Cies
Coes
Cres
QG
RGint
td(on)
tr
VGE=VCE, IC = 5.2 mA
VGE = 0 V, VCE = 1200 V, Tj = 25 °C
f = 1 MHz
5.2
8.8
0.58
0.47
850
2.4
93
34
14.5
300
65
VCE = 25 V
f = 1 MHz
f = 1 MHz
V
GE = 0 V
VGE = - 8 V...+ 15 V
Tj = 25 °C
VCC = 600 V
Tj = 150 °C
Tj = 150 °C
Tj = 150 °C
Tj = 150 °C
Tj = 150 °C
I
C = 150 A
V
R
R
GE = +15/-15 V
Eon
td(off)
tf
G on = 2 Ω
G off = 1 Ω
di/dton = 4200 A/µs
di/dtoff = 1880 A/µs
dv/dt = 4800 V/µs
Ls = 25 nH
Tj = 150 °C
Eoff
12
mJ
Rth(j-c)
Rth(c-s)
per IGBT
per IGBT (λgrease=0.81 W/(m*K))
0.2
K/W
K/W
0.072
GB
© by SEMIKRON
Rev. 1.0 – 11.06.2020
1