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SKCD 14 C 120 I HD PDF预览

SKCD 14 C 120 I HD

更新时间: 2024-09-27 14:53:35
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赛米控丹佛斯 - SEMIKRON /
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SKCD 14 C 120 I HD 数据手册

 浏览型号SKCD 14 C 120 I HD的Datasheet PDF文件第2页 
SKCD 14 C 120 I HD  
Absolute Maximum Ratings  
Symbol Conditions  
Values  
Unit  
Tj = 25 °C, IR = 0.075 mA  
VRRM  
IFSM  
1200  
210  
170  
145  
150  
V
A
A
A²s  
°C  
Tj = 25 °C  
Tj = 150 °C  
10 ms  
sin 180°  
Tj = 150 °C, tp = 10 ms, sin 180°  
i²t  
Tjmax  
Electrical Characteristics  
Symbol Conditions  
CAL-DIODE  
min.  
typ.  
max.  
Unit  
IF = 20 A 1)  
Tc = 80 °C, Tj = 150 °C, Fi=PI/2,  
IF(AV)  
IR  
17  
A
Semitrans Assembly; Rth(j-c) = 1.7 K/W  
Tj = 25 °C, VRRM = 1200 V  
Tj = 125 °C, VRRM = 1200 V  
Tj = 25 °C, IF = 15 A  
VRRM = 1200 V  
Size: 3.74 x 3.74 mm²  
0.075  
1.50  
1.77  
1.77  
mA  
mA  
V
V
V
VF  
1.50  
1.50  
0.92  
35.2  
SKCD 14 C 120 I HD  
Tj = 125 °C, IF = 15 A  
Tj = 125 °C  
Tj = 125 °C  
V(TO)  
rT  
m  
Features  
ꢀ high current density  
ꢀ easy paralleling due to a small forward  
voltage spread  
Dynamic Characteristics  
Symbol Conditions  
min.  
typ.  
max.  
Unit  
ꢀ positive temperature coefficient  
ꢀ very soft recovery behavior  
ꢀ small switching losses  
ꢀ high ruggedness  
ꢀ compatible to thick wire bonding  
ꢀ compatible to standard solder  
processes  
Tj = 25 °C, 20 A, 600 V, 400 A/µs  
Err  
Err  
Qrr  
Qrr  
Irrm  
Irrm  
0.7  
1.3  
2.2  
4
14  
19  
mJ  
mJ  
µC  
µC  
A
Tj = 125 °C, 20 A, 600 V, 400 A/µs  
Tj = 25 °C, 20 A, 600 V, 400 A/µs  
Tj = 125 °C, 20 A, 600, 400 A/µs  
Tj = 25 °C, 20 A, 600 V, 400 A/µs  
Tj = 125 °C, 20 A, 600, 400 A/µs  
A
Typical Applications*  
ꢀ freewheeling diode for IGBT  
ꢀ particularly suitable for frequencies < 8  
kHz  
Thermal Characteristics  
Symbol Conditions  
min.  
typ.  
max.  
Unit  
Footnotes  
Tj  
Tstg  
Tsolder  
Tsolder  
-40  
-40  
150  
150  
250  
320  
°C  
°C  
°C  
°C  
1) Nominal IGBT IF rating,  
verified by design and characterization  
10 min.  
5 min.  
Mechanical Characteristics  
Symbol Conditions  
Values  
Unit  
Raster  
size  
Area total  
Anode  
3.74 x 3.74  
mm2  
mm²  
13.99  
bondable (Al)  
Cathode  
Wire bond  
Package  
solderable (Ag/Ni)  
Al, diameter 500 µm  
150 mm wafer frame  
Chips /  
Package  
1070  
pcs  
SKCD  
© by SEMIKRON  
Rev. 0 – 29.11.2012  
1