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SIZ300DT_12 PDF预览

SIZ300DT_12

更新时间: 2024-09-30 11:59:23
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
14页 330K
描述
Dual N-Channel 30 V (D-S) MOSFETs

SIZ300DT_12 数据手册

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New Product  
SiZ300DT  
Vishay Siliconix  
Dual N-Channel 30 V (D-S) MOSFETs  
FEATURES  
PRODUCT SUMMARY  
PowerPAIR Optimizes High-Side and Low-Side  
VDS (V)  
RDS(on) ()  
Qg (Typ.)  
MOSFETs for Synchronous Buck Converters  
TrenchFET® Power Mosfets  
I
D (A)a  
11  
0.0240 at VGS = 10 V  
0.0320 at VGS = 4.5 V  
0.0110 at VGS = 10 V  
0.0165 at VGS = 4.5 V  
Channel-1  
Channel-2  
30  
3.5 nC  
100 % Rg and UIS Tested  
11  
Material categorization: For definitions of  
28  
30  
6.8 nC  
compliance please see www.vishay.com/doc?99912  
28  
APPLICATIONS  
Computing System Power  
POL  
PowerPAIR® 3 x 3  
Pin 1  
Synchronous Buck Converter  
G1  
D1  
1
D1  
D
1
2
D1  
D1  
3
4
S1/D2  
(Pin 9)  
G
1
8
G2  
7
N-Channel 1  
S /D  
1 2  
S2  
MOSFET  
6
S2  
5
S2  
G
2
N-Channel 2  
MOSFET  
Ordering Information:  
SiZ300DT-T1-GE3 (Lead (Pb)-free and Halogen-free)  
S
2
ABSOLUTE MAXIMUM RATINGS (T = 25 °C, unless otherwise noted)  
A
Parameter  
Symbol  
Channel-1  
Channel-2  
Unit  
V
VDS  
30  
20  
Drain-Source Voltage  
Gate-Source Voltage  
VGS  
11a  
11a  
28a  
28a  
TC = 25 °C  
C = 70 °C  
T
ID  
Continuous Drain Current (TJ = 150 °C)  
9.8b, c  
14.9b, c  
TA = 25 °C  
TA = 70 °C  
7.8b, c  
30  
11a  
3.2b, c  
12  
11.9b, c  
40  
A
IDM  
IS  
Pulsed Drain Current (t = 300 µs)  
TA = 25 °C  
TA = 25 °C  
26  
3.8b, c  
15  
Continuous Source Drain Diode Current  
IAS  
Avalanche Current  
L = 0.1 mH  
EAS  
7
11  
31  
20  
4.2b, c  
2.7b, c  
mJ  
W
Single Pulse Avalanche Energy  
TC = 25 °C  
TC = 70 °C  
TA = 25 °C  
TA = 70 °C  
16.7  
10.7  
3.7b, c  
2.4b, c  
PD  
Maximum Power Dissipation  
TJ, Tstg  
- 55 to 150  
260  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)d, e  
°C  
Notes:  
a. Package limited.  
b. Surface mounted on 1" x 1" FR4 board.  
c. t = 10 s.  
d. See solder profile (www.vishay.com/doc?73257). The PowerPAIR is a leadless package. The end of the lead terminal is exposed copper (not  
plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required  
to ensure adequate bottom side solder interconnection.  
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.  
Document Number: 67715  
S12-1361-Rev. D, 11-Jun-12  
For technical questions, contact: pmostechsupport@vishay.com  
This document is subject to change without notice.  
www.vishay.com  
1
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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