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SIHFU9024-E3 PDF预览

SIHFU9024-E3

更新时间: 2024-11-25 12:14:51
品牌 Logo 应用领域
科盛美 - KERSEMI 晶体晶体管开关脉冲局域网
页数 文件大小 规格书
7页 4492K
描述
Power MOSFET

SIHFU9024-E3 数据手册

 浏览型号SIHFU9024-E3的Datasheet PDF文件第2页浏览型号SIHFU9024-E3的Datasheet PDF文件第3页浏览型号SIHFU9024-E3的Datasheet PDF文件第4页浏览型号SIHFU9024-E3的Datasheet PDF文件第5页浏览型号SIHFU9024-E3的Datasheet PDF文件第6页浏览型号SIHFU9024-E3的Datasheet PDF文件第7页 
IRFR9024, IRFU9024, SiHFR9024, SiHFU9024  
Power MOSFET  
FEATURES  
PRODUCT SUMMARY  
VDS (V)  
• Dynamic dV/dt Rating  
- 60  
• Repetitive Avalanche Rated  
Available  
R
DS(on) (Ω)  
VGS = - 10 V  
0.28  
• Surface Mount (IRFR9024/SiHFR9024)  
RoHS*  
COMPLIANT  
Qg (Max.) (nC)  
Qgs (nC)  
19  
• Straight Lead (IRFU9024/SiHFU9024)  
5.4  
• Available in Tape and Reel  
Qgd (nC)  
11  
• P-Channel  
Configuration  
Single  
• Fast Switching  
S
• Lead (Pb)-free Available  
DESCRIPTION  
Third generation Power MOSFETs from Vishay provide the  
designer with the best combination of fast switching,  
ruggedized device design, low on-resistance and  
cost-effictiveness.  
DPAK  
(TO-252)  
IPAK  
(TO-251)  
G
The DPAK is designed for surface mounting using vapor  
phase, infrared, or wave soldering techniques. The straight  
lead version (IRFU/SiHFU series) is for through-hole  
mounting applications. Power dissipation levels up to 1.5 W  
are possible in typical surcace mount applications.  
D
P-Channel MOSFET  
ORDERING INFORMATION  
Package  
DPAK (TO-252)  
IRFR9024PbF  
SiHFR9024-E3  
IRFR9024  
DPAK (TO-252)  
IRFR9024TRPbFa  
SiHFR9024T-E3a  
IRFR9024TRa  
DPAK (TO-252)  
IRFR9024TRLPbFa  
SiHFR9024TL-E3a  
IRFR9024TRLa  
SiHFR9024TLa  
DPAK (TO-252)  
IRFR9024TRRPbFa  
SiHFR9024TR-E3a  
IPAK (TO-251)  
IRFU9024PbF  
SiHFU9024-E3  
IRFU9024  
Lead (Pb)-free  
-
-
SnPb  
SiHFR9024  
SiHFR9024Ta  
SiHFU9024  
Note  
a. See device orientation.  
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted  
PARAMETER  
SYMBOL  
LIMIT  
- 60  
UNIT  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
V
VGS  
20  
TC = 25 °C  
TC =100°C  
- 8.8  
- 5.6  
- 35  
Continuous Drain Current  
VGS at - 10 V  
ID  
A
Pulsed Drain Currenta  
IDM  
Linear Derating Factor  
0.33  
W/°C  
Linear Derating Factor (PCB Mount)e  
Single Pulse Avalanche Energyb  
Repetitive Avalanche Currenta  
0.020  
300  
EAS  
IAR  
mJ  
A
- 8.8  
5.0  
Repetitive Avalanche Energya  
EAR  
mJ  
Maximum Power Dissipation  
Maximum Power Dissipation (PCB Mount)e  
Peak Diode Recovery dV/dtc  
TC = 25 °C  
42  
PD  
W
V/ns  
°C  
TA = 25 °C  
2.5  
dV/dt  
- 4.5  
- 55 to + 150  
260d  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)  
TJ, Tstg  
for 10 s  
Notes  
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).  
b. VDD = - 25 V, starting TJ = 25 °C, L = 4.5 mH, RG = 25 Ω, IAS = - 8.8 A (see fig. 12).  
c. ISD - 11 A, dI/dt 140 A/µs, VDD VDS, TJ 150 °C.  
d. 1.6 mm from case.  
e. When mounted on 1" square PCB (FR-4 or G-10 material).  
www.kersemi.com  
1

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