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SIHF840LCS-E3 PDF预览

SIHF840LCS-E3

更新时间: 2024-11-26 06:11:39
品牌 Logo 应用领域
威世 - VISHAY 晶体晶体管功率场效应晶体管开关脉冲局域网
页数 文件大小 规格书
8页 1029K
描述
Power MOSFET

SIHF840LCS-E3 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:D2PAK
包装说明:SMALL OUTLINE, R-PSSO-G2针数:4
Reach Compliance Code:unknownHTS代码:8541.29.00.95
风险等级:5.06Is Samacsys:N
其他特性:AVALANCHE RATED雪崩能效等级(Eas):510 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:500 V最大漏极电流 (Abs) (ID):8 A
最大漏极电流 (ID):8 A最大漏源导通电阻:0.85 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:TO-263AB
JESD-30 代码:R-PSSO-G2JESD-609代码:e3
湿度敏感等级:1元件数量:1
端子数量:2工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):260极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):125 W最大脉冲漏极电流 (IDM):28 A
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:YES端子面层:Matte Tin (Sn)
端子形式:GULL WING端子位置:SINGLE
处于峰值回流温度下的最长时间:40晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

SIHF840LCS-E3 数据手册

 浏览型号SIHF840LCS-E3的Datasheet PDF文件第2页浏览型号SIHF840LCS-E3的Datasheet PDF文件第3页浏览型号SIHF840LCS-E3的Datasheet PDF文件第4页浏览型号SIHF840LCS-E3的Datasheet PDF文件第5页浏览型号SIHF840LCS-E3的Datasheet PDF文件第6页浏览型号SIHF840LCS-E3的Datasheet PDF文件第7页 
IRF840LCS, IRF840LCL, SiHF840LCS, SiHF840LCL  
Vishay Siliconix  
Power MOSFET  
FEATURES  
PRODUCT SUMMARY  
VDS (V)  
• Ultra Low Gate Charge  
500  
• Reduced Gate Drive Requirement  
Available  
RDS(on) (Ω)  
VGS = 10 V  
0.85  
• Enhanced 30 V VGS Rating  
• Reduced Ciss, Coss, Crss  
• Extremely High Frequency Operation  
• Repetitive Avalanche Rated  
• Lead (Pb)-free Available  
RoHS*  
Qg (Max.) (nC)  
39  
10  
COMPLIANT  
Q
Q
gs (nC)  
gd (nC)  
19  
Configuration  
Single  
DESCRIPTION  
D
This new series of low charge Power MOSFETs achieve  
significantly lower gate charge then conventional Power  
MOSFETs. Utilizing the new LCDMOS (low charge device  
Power MOSFETs) technology, the device improvements are  
achieved without added product cost, allowing for reduced  
gate drive requirements and total system savings. In  
addition, reduced switching losses and improved efficiency  
are achievable in a variety of high frequency applications.  
Frequencies of a few MHz at high current are possible using  
the new low charge Power MOSFETs.  
D2PAK  
(TO-263)  
I2PAK  
(TO-262)  
G
G
D
S
S
N-Channel MOSFET  
These device improvements combined with the proven  
ruggedness and reliability that characterize Power  
MOSFETs offer the designer a new power transistor  
standard for switching applications.  
ORDERING INFORMATION  
Package  
D2PAK (TO-263)  
IRF840LCSPbF  
D2PAK (TO-263)  
-
-
IRF840LCSTRRa  
SiHF840LCSTa  
I2PAK (TO-262)  
IRF840LCLPbF  
SiHF840LCL-E3  
IRF840LCL  
Lead (Pb)-free  
SiHF840LCS-E3  
IRF840LCS  
SiHF840LCS  
SnPb  
SiHF840LCL  
Note  
a. See device orientation.  
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted  
PARAMETER  
SYMBOL  
LIMIT  
UNIT  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
VGS  
500  
30  
V
T
C = 25 °C  
8.0  
Continuous Drain Current  
V
GS at 10 V  
ID  
TC =100°C  
5.1  
A
Pulsed Drain Currenta, e  
Linear Derating Factor  
Single Pulse Avalanche Energyb, e  
Avalanche Currenta  
IDM  
28  
1.0  
W/°C  
mJ  
A
EAS  
IAR  
510  
8.0  
Repetiitive Avalanche Energya  
EAR  
13  
mJ  
T
C = 25 °C  
3.1  
Maximum Power Dissipation  
PD  
W
V/ns  
°C  
TA = 25 °C  
125  
Peak Diode Recovery dV/dtc, e  
dV/dt  
3.5  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)  
TJ, Tstg  
- 55 to + 150  
300d  
for 10 s  
Notes  
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).  
b. Starting TJ = 25 °C, L = 14 mH, RG = 25 Ω, IAS = 8.0 A (see fig. 12).  
c. ISD 8.0 A, dI/dt 100 A/µs, VDD VDS, TJ 150 °C.  
d. 1.6 mm from case.  
e. Uses IRF840LC/SiHF840LC data and test conditions.  
* Pb containing terminations are not RoHS compliant, exemptions may apply  
Document Number: 91068  
S-Pending-Rev. A, 02-Jun-08  
www.vishay.com  
1
WORK-IN-PROGRESS  

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