IRF840S, SiHF840S
Vishay Siliconix
Power MOSFET
FEATURES
PRODUCT SUMMARY
VDS (V)
• Surface Mount
500
• Available in Tape and Reel
• Dynamic dV/dt Rating
Available
R
DS(on) (Ω)
VGS = 10 V
0.85
RoHS*
Qg (Max.) (nC)
63
9.3
COMPLIANT
• Repetitive Avalanche Rated
• Fast Switching
Q
Q
gs (nC)
gd (nC)
32
• Ease of Paralleling
Configuration
Single
• Simple Drive Requirement
• Lead (Pb)-free Available
D
D2PAK (TO-263)
DESCRIPTION
Third generation Power MOSFETs from Vishay provide the
designer with the best combination of fast switching,
ruggedized device design, low on-resistance and
cost-effectiveness.
G
The SMD-220 is a surface mount power package capable of
accommodating die size up to HEX-4. It provides the highest
power capability and the lowest possible on-resistance in
any existing surface mount package. The SMD-220 is
suitable for high current applications because of its low
internal connection resistance and can dissipate up to 2.0 W
in a typical surface mount application.
D
G
S
N-Channel MOSFET
S
ORDERING INFORMATION
Package
D2PAK (TO-263)
IRF840SPbF
D2PAK (TO-263)
IRF840STRLPbFa
SiHF840STL-E3a
IRF840STRaL
D2PAK (TO-263)
IRF840STRRPbFa
SiHF840STR-E3a
IRF840STRa
Lead (Pb)-free
SiHF840S-E3
IRF840S
SiHF840S
SnPb
SiHF840STLa
SiHF840STRa
Note
a. See device orientation.
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted
PARAMETER
SYMBOL
LIMIT
500
UNIT
Drain-Source Voltage
Gate-Source Voltage
VDS
V
VGS
20
T
C = 25 °C
8.0
Continuous Drain Current
V
GS at 10 V
ID
TC =100°C
5.1
A
Pulsed Drain Currenta
IDM
32
Linear Derating Factor
1.0
W/°C
Linear Derating Factor (PCB Mount)e
Single Pulse Avalanche Energyb
Avalanche Currenta
0.025
510
EAS
IAR
mJ
A
8.0
Repetiitive Avalanche Energya
EAR
13
mJ
Maximum Power Dissipation
Maximum Power Dissipation (PCB Mount)e
Peak Diode Recovery dV/dtc
TC = 25 °C
125
PD
W
V/ns
°C
TA = 25 °C
3.1
dV/dt
3.5
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)
TJ, Tstg
- 55 to + 150
300d
for 10 s
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. VDD = 50 V, starting TJ = 25 °C, L = 14 mH, RG = 25 Ω, IAS = 8.0 A (see fig. 12).
c. ISD ≤ 8.0 A, dI/dt ≤ 100 A/µs, VDD ≤ VDS, TJ ≤ 150 °C.
d. 1.6 mm from case.
e. When mounted on 1" square PCB (FR-4 or G-10 material).
* Pb containing terminations are not RoHS compliant, exemptions may apply
Document Number: 91071
S-81432-Rev. A, 07-Jul-08
www.vishay.com
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