Datasheet > SiA108DJ

SiA108DJ

更新时间： 2024-11-10 14:51:39

品牌	Logo	应用领域
威世 - VISHAY		/
页数	文件大小	规格书
9页	275K
描述
N-Channel 80 V (D-S) MOSFET

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SiA108DJ 数据手册

SiA108DJ

Vishay Siliconix

www.vishay.com

N-Channel 80 V (D-S) MOSFET

FEATURES

PowerPAK^®SC-70-6L Single

• TrenchFET^®Gen IV power MOSFET

• Tuned for the lowest R_DSx Q_oss

• 100% R_gand UIS tested

• Material categorization:

for definitions of compliance please see

www.vishay.com/doc?99912

APPLICATIONS

• Primary side switch

• DC/DC converter

• Motor drive switch

Top View

Bottom View

PRODUCT SUMMARY

V_DS(V)

0.038

0.046

7.1

• Boost converter

R_DS(on)max. () at V_GS= 10 V

R_DS(on)max. () at V_GS= 7.5 V

Q_gtyp. (nC)

• LED backlighting

_D(A) ^a

N-Channel MOSFET

Configuration

Single

ORDERING INFORMATION

Package

PowerPAK SC-70

SiA108DJ-T1-GE3

Lead (Pb)-free and halogen-free

ABSOLUTE MAXIMUM RATINGS (T_A= 25 °C, unless otherwise noted)

PARAMETER

Drain-source voltage

Gate-source voltage

SYMBOL

LIMIT

UNIT

V_DS

V_GS

T_C= 25 °C

_C= 70 °C

12 ^a

6.6 ^{b, c}

5.3 ^{b, c}

Continuous drain current (T_J= 150 °C)

I_D

T_A=25 °C

T_A= 70 °C

Pulsed drain current (t = 100 μs)

I_DM

I_S

T_C= 25 °C

T_A= 70 °C

12 ^a

2.9 ^{b, c}

Continuous source-drain diode current

Single pulse avalanche current

Single pulse avalanche energy

I_AS

L = 0.1 mH

E_AS

7.2

T_C= 25 °C

T_C= 70 °C

T_A= 25 °C

T_A= 70 °C

Maximum power dissipation

P_D

3.5 ^{b, c}

2.2 ^{b, c}

-55 to +150

260

Operating junction and storage temperature range

Soldering recommendations (peak temperature) ^{d, e}

T_J, T_stg

°C

THERMAL RESISTANCE RATINGS

PARAMETER

Maximum junction-to-ambient ^{b, f}

SYMBOL

R_thJA

TYPICAL

MAXIMUM

UNIT

t  5 s

Steady state

°C/W

Maximum junction-to-case (drain)

R_thJC

5.3

6.5

Notes

a. Package limited

b. Surface mounted on 1" x 1" FR4 board

c. t = 5 s

d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SC-70 is a leadless package. The end of the lead terminal is exposed

copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed

and is not required to ensure adequate bottom side solder interconnection

e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components

f. Maximum under steady state conditions is 80 °C/W

S18-1288-Rev. A, 31-Dec-2018

Document Number: 77827

For technical questions, contact: pmostechsupport@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

12 3 4 5 6 7...9

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