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SIA414DJ_08 PDF预览

SIA414DJ_08

更新时间: 2024-11-09 09:25:39
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
9页 193K
描述
N-Channel 8-V (D-S) MOSFET

SIA414DJ_08 数据手册

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New Product  
SiA414DJ  
Vishay Siliconix  
N-Channel 8-V (D-S) MOSFET  
FEATURES  
PRODUCT SUMMARY  
Halogen-free  
VDS (V)  
RDS(on) (Ω)  
Qg (Typ.)  
I
D (A)a  
12  
TrenchFET® Power MOSFET  
New Thermally Enhanced PowerPAK®  
SC-70 Package  
0.011 at VGS = 4.5 V  
0.013 at VGS = 2.5 V  
0.016 at VGS = 1.8 V  
0.022 at VGS = 1.5 V  
0.041 at VGS = 1.2 V  
RoHS  
COMPLIANT  
12  
- Small Footprint Area  
8
12  
19 nC  
12  
APPLICATIONS  
Load Switch for Portable Applications  
12  
PowerPAK SC-70-6L-Single  
D
1
D
Marking Code  
2
D
A C X  
X X X  
G
3
Part # code  
G
D
6
Lot Traceability  
and Date code  
S
D
5
S
2.05 mm  
S
2.05 mm  
4
Ordering Information: SiA414DJ-T1-GE3 (Lead (Pb)-free and Halogen-free)  
N-Channel MOSFET  
ABSOLUTE MAXIMUM RATINGS T = 25 °C, unless otherwise noted  
A
Parameter  
Symbol  
Limit  
Unit  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
VGS  
8
V
5
12a  
12a  
TC = 25 °C  
C = 70 °C  
TA = 25 °C  
TA = 70 °C  
T
Continuous Drain Current (TJ = 150 °C)  
ID  
12a, b, c  
11.6b, c  
40  
A
IDM  
IS  
Pulsed Drain Current  
12a  
2.9b, c  
19  
T
C = 25 °C  
Continuous Source-Drain Diode Current  
TA = 25 °C  
TC = 25 °C  
T
C = 70 °C  
12  
PD  
Maximum Power Dissipation  
W
3.5b, c  
TA = 25 °C  
TA = 70 °C  
2.2b, c  
TJ, Tstg  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)d, e  
- 55 to 150  
°C  
260  
THERMAL RESISTANCE RATINGS  
Parameter  
Symbol  
RthJA  
RthJC  
Typical  
28  
Maximum  
Unit  
Maximum Junction-to-Ambientb, f  
Maximum Junction-to-Case (Drain)  
t 5 s  
Steady State  
36  
°C/W  
5.3  
6.5  
Notes:  
a. Package limited  
b. Surface Mounted on 1" x 1" FR4 board.  
c. t = 5 s.  
d. See Solder Profile (http://www.vishay.com/ppg?73257). The PowerPAK SC-70 is a leadless package. The end of the lead terminal is exposed  
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed  
and is not required to ensure adequate bottom side solder interconnection.  
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.  
f. Maximum under Steady State conditions is 80 °C/W.  
Document Number: 73954  
S-80435-Rev. B, 03-Mar-08  
www.vishay.com  
1

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