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SiA430DJT PDF预览

SiA430DJT

更新时间: 2024-09-16 14:56:03
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
10页 304K
描述
N-Channel 20 V (D-S) MOSFET

SiA430DJT 数据手册

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SiA430DJT  
Vishay Siliconix  
www.vishay.com  
N-Channel 20 V (D-S) MOSFET  
FEATURES  
• TrenchFET® power MOSFET  
• Thermally enhanced PowerPAK® SC-70 package  
- Small footprint area  
PRODUCT SUMMARY  
VDS (V)  
RDS(on) (Ω) MAX.  
0.0135 at VGS = 10 V  
0.0185 at VGS = 4.5 V  
ID (A) b, c Qg (Typ.)  
12 a  
20  
5.3 nC  
10.8  
- Ultra-thin 0.6 mm height  
• 100 % Rg tested  
Thin PowerPAK® SC-70-6L Single  
• Material categorization:  
for definitions of compliance please see  
www.vishay.com/doc?99912  
D
D
5
6
S
4
APPLICATIONS  
0.6 mm  
D
• Load switch  
S
7
1
D
• DC/DC conversion  
2
D
3
1
G
G
Top View  
Bottom View  
Marking Code: AY  
Ordering Information:  
S
SiA430DJT-T1-GE3 (Lead (Pb)-free and halogen-free)  
N-Channel MOSFET  
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)  
PARAMETER  
SYMBOL  
LIMIT  
20  
UNIT  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
V
VGS  
20  
TC = 25 °C  
12 a  
TC = 70 °C  
TA = 25 °C  
TA = 70 °C  
12 a  
Continuous Drain Current (TJ = 150 °C)  
ID  
12 a, b, c  
10.1 b, c  
40  
12 a  
2.9 b, c  
A
Pulsed Drain Current (t = 100 μs)  
IDM  
IS  
TC = 25 °C  
Continuous Source-Drain Diode Current  
TA = 25 °C  
T
C = 25 °C  
C = 70 °C  
19.2  
T
12.3  
Maximum Power Dissipation  
PD  
W
TA = 25 °C  
TA = 70 °C  
3.5 b, c  
2.2 b, c  
-55 to +150  
260  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature) d, e  
TJ, Tstg  
°C  
THERMAL RESISTANCE RATINGS  
PARAMETER  
Maximum Junction-to-Ambient b, f  
SYMBOL  
TYPICAL  
28  
MAXIMUM  
UNIT  
t 5 s  
Steady State  
RthJA  
RthJC  
36  
°C/W  
Maximum Junction-to-Case (Drain)  
5.3  
6.5  
Notes  
a. Package limited  
b. Surface mounted on 1" x 1" FR4 board.  
c. t = 5 s.  
d. See solder profile (www.vishay.com/doc?73257). The Thin PowerPAK SC-70 is a leadless package. The end of the lead terminal is exposed  
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed  
and is not required to ensure adequate bottom side solder interconnection.  
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.  
f. Maximum under steady state conditions is 80 °C/W.  
S14-2236-Rev. A, 10-Nov-14  
Document Number: 62991  
1
For technical questions, contact: pmostechsupport@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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