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SIA400EDJ

更新时间: 2024-09-16 12:20:35
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
9页 224K
描述
N-Channel 30 V (D-S) MOSFET

SIA400EDJ 数据手册

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New Product  
SiA400EDJ  
Vishay Siliconix  
N-Channel 30 V (D-S) MOSFET  
FEATURES  
PRODUCT SUMMARY  
Halogen-free According to IEC 61249-2-21  
Definition  
VDS (V)  
RDS(on) ()  
Qg (Typ.)  
I
D (A)a  
12  
TrenchFET® Power MOSFET  
New Thermally Enhanced PowerPAK®  
RoHS  
0.019 at VGS = 4.5 V  
0.025 at VGS = 2.5 V  
COMPLIANT  
30  
11.6  
12  
SC-70 Package  
- Small Footprint Area  
Typical ESD Performance 2500 V HBM  
100 % Rg and UIS Tested  
PowerPAK SC-70-6L-Single  
Compliant to RoHS Directive 2002/95/EC  
1
D
APPLICATIONS  
2
Load Switch, OVP Switch  
Boost Converters  
DC/DC Converters  
D
3
G
D
6
D
S
D
5
Marking Code  
2.05 mm  
S
2.05 mm  
G
4
A I X  
Part # code  
X X X  
Lot Traceability  
and Date code  
Ordering Information:  
SiA400EDJ-T1-GE3 (Lead (Pb)-free and Halogen-free)  
S
N-Channel MOSFET  
ABSOLUTE MAXIMUM RATINGS (T = 25 °C, unless otherwise noted)  
A
Parameter  
Symbol  
Limit  
30  
Unit  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
VGS  
V
12  
12a  
TC = 25 °C  
C = 70 °C  
TA = 25 °C  
TA = 70 °C  
12a  
T
Continuous Drain Current (TJ = 150 °C)  
ID  
11b, c  
8.8b, c  
30  
A
IDM  
IS  
Pulsed Drain Current (t = 300 µs)  
12a  
2.9b, c  
15  
11.25  
19.2  
12.3  
3.5b, c  
2.2b, c  
- 55 to 150  
260  
TC = 25 °C  
TA = 25 °C  
Continuous Source-Drain Diode Current  
IAS  
EAS  
Avalanche Current  
Single Pulse Avalanche  
L = 0.1 mH  
mJ  
W
TC = 25 °C  
TC = 70 °C  
TA = 25 °C  
TA = 70 °C  
PD  
Maximum Power Dissipation  
TJ, Tstg  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)d, e  
°C  
THERMAL RESISTANCE RATINGS  
Parameter  
Symbol  
RthJA  
RthJC  
Typical  
28  
Maximum  
Unit  
Maximum Junction-to-Ambientb, f  
Maximum Junction-to-Case (Drain)  
t 5 s  
Steady State  
36  
°C/W  
5.3  
6.5  
Notes:  
a. Package limited.  
b. Surface mounted on 1" x 1" FR4 board.  
c. t = 5 s.  
d. See solder profile (www.vishay.com/ppg?73257). The PowerPAK SC-70 is a leadless package. The end of the lead terminal is exposed  
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed  
and is not required to ensure adequate bottom side solder interconnection.  
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.  
f. Maximum under steady state conditions is 80 °C/W.  
Document Number: 67844  
S11-1148-Rev. A, 13-Jun-11  
www.vishay.com  
1
This document is subject to change without notice.  
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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