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SIA408DJ PDF预览

SIA408DJ

更新时间: 2024-11-09 12:20:35
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
9页 184K
描述
N-Channel 30 V (D-S) MOSFET

SIA408DJ 数据手册

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SiA408DJ  
Vishay Siliconix  
N-Channel 30 V (D-S) MOSFET  
FEATURES  
PRODUCT SUMMARY  
Halogen-free According to IEC 61249-2-21  
VDS (V)  
RDS(on) ()  
ID (A)a  
4.5  
Qg (Typ.)  
Definition  
TrenchFET® Power MOSFET  
0.036 at VGS = 10 V  
0.039 at VGS = 4.5 V  
0.053 at VGS = 2.5 V  
New Thermally Enhanced PowerPAK®  
SC-70 Package  
30  
7 nC  
4.5  
4.5  
- Small Footprint Area  
Compliant to RoHS Directive 2002/95/EC  
APPLICATIONS  
Load Switch for Portable Applications  
DC/DC Converter  
PowerPAK SC-70-6L-Single  
D
1
D
2
Marking Code  
D
3
A E X  
G
G
Part # code  
D
X X X  
6
Lot Traceability  
and Date code  
S
D
5
S
2.05 mm  
S
2.05 mm  
4
Ordering Information: SiA408DJ-T1-GE3 (Lead (Pb)-free and Halogen-free)  
N-Channel MOSFET  
ABSOLUTE MAXIMUM RATINGS (T = 25 °C, unless otherwise noted)  
A
Parameter  
Symbol  
Limit  
30  
Unit  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
VGS  
V
12  
4.5a  
TC = 25 °C  
TC = 70 °C  
TA = 25 °C  
TA = 70 °C  
4.5a  
Continuous Drain Current (TJ = 150 °C)  
ID  
4.5a, b, c  
4.5b, c  
20  
A
IDM  
IS  
Pulsed Drain Current  
4.5a  
2.8b, c  
17.9  
T
C = 25 °C  
Continuous Source-Drain Diode Current  
TA = 25 °C  
TC = 25 °C  
T
C = 70 °C  
11.4  
Maximum Power Dissipation  
PD  
W
3.4b, c  
2.2b, c  
- 55 to 150  
260  
TA = 25 °C  
TA = 70 °C  
TJ, Tstg  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)d, e  
°C  
THERMAL RESISTANCE RATINGS  
Parameter  
Symbol  
RthJA  
RthJC  
Typical  
29  
Maximum  
Unit  
Maximum Junction-to-Ambientb, f  
Maximum Junction-to-Case (Drain)  
t 5 s  
Steady State  
37  
7
°C/W  
5.5  
Notes:  
a. Package limited  
b. Surface mounted on 1" x 1" FR4 board.  
c. t = 5 s.  
d. See solder profile (www.vishay.com/ppg?73257). The PowerPAK SC-70 is a leadless package. The end of the lead terminal is exposed  
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed  
and is not required to ensure adequate bottom side solder interconnection.  
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.  
f. Maximum under steady state conditions is 80 °C/W.  
Document Number: 69255  
S10-2546-Rev. D, 08-Nov-10  
www.vishay.com  
1

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