Datasheet > SG-BGA-6016

SG-BGA-6016

更新时间： 2024-09-19 01:21:47

品牌	Logo	应用领域
IRONWOOD		/
页数	文件大小	规格书
4页	132K
描述
Ball guide prevents over compression of elastomer

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中文翻译

获取价格

数据手册

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SG-BGA-6016 数据手册

GHz BGA Socket - Direct mount, solderless

Features

Top View

Directly mounts to target PCB (needs tooling holes) with hardware.

High speed, reliable Elastomer connection

Minimum real estate required

Compression plate distributes forces evenly

Ball guide prevents over compression of elastomer

Easily removable swivel socket lid

47.725mm

Socket Lid: Black anodized Aluminum.

Thickness = 2.5mm.

Socket base: Black anodized Aluminum.

Thickness = 6.5mm.

Compression Plate: Black anodized Aluminum.

Thickness = 4.0mm.

47.725mm

Compression screw: Clear anodized Aluminum.

Thickness = 5mm, Hex socket = 5mm.

Elastomer: 40 micron dia gold plated brass

filaments arranged symmetrically in a silicone

rubber (63.5 degree angle).

Recommended torque = 26 in lbs./

416 in oz.

Thickness = 0.75mm.

Elastomer Guide: Cirlex or equivalent.

Thickness = 0.725mm.

Assembled

10.11mm +

IC thickness

Ball Guide: Kapton polyimide.

Socket base screw: Socket head cap, Alloy steel with

black oxide finish, 0-80 fine thread , 12.7mm long.

Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine

thread.

Insulation Plate: FR4/G10, Thickness = 1.59mm.

Side View

(Section AA)

Backing Plate: Black anodized Aluminum.

Thickness = 6.35mm.

Customer's

BGA IC

Customer's Target PCB

All tolerances: ±0.125mm (unless stated

otherwise). Materials and specifications

are subject to change without notice.

Scale: -

Status: Released

Rev: H

Date: 8/20/01

Modified: 7/16/09, AE

SG-BGA-6016 Drawing

11351 Rupp Drive, Suite 400, Burnsville, MN 55337

Tele: (952) 229-8200

Drawing: Meghann Fedde

File: SG-BGA-6016 Dwg

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