Datasheet > SG-BGA-6193

SG-BGA-6193

更新时间： 2024-09-19 00:33:03

品牌	Logo	应用领域
IRONWOOD		/
页数	文件大小	规格书
5页	132K
描述
Ball guide prevents over compression of elastomer

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数据手册

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SG-BGA-6193 数据手册

GHz BGA Socket - Direct mount, solderless

Features

Top View

(without fan)

Directly mounts to target PCB (needs tooling holes) with hardware.

High speed, reliable Elastomer connection

Minimum real estate required

Compression plate distributes forces evenly

Ball guide prevents over compression of elastomer

Apply 6 in-oz

Fan: 10mm thick, 50mm square, 12V, 0.29 m3/min

torque per screw

Socket base: Black anodized Aluminum.

Thickness = 5mm.

Heat Sink Lid: Black anodized Aluminum.

Elastomer: 40 micron dia gold plated brass

filaments arranged symmetrically in a silicone

rubber (63.5 degree angle).

Thickness = 0.75mm.

Side View

(Section AA)

Elastomer Guide: Ultem 1000

Thickness = 0.75mm.

Ball Guide: ultem 1000.

Assembled

46mm + IC thickness

Socket base screw: Socket head cap, Alloy steel with

black oxide finish, M2 thread, 12mm long

Socket lid screw: Socket head cap, Alloy steel with

black oxide finsih, M2 thread, 10mm long

Backing Plate: Stainless steel.

Thermal Pad: Bergquist Gap Pad

Thickness = 0.015".

Customer's Target PCB

BGA package

All tolerances: ±0.125mm (unless stated

otherwise). Materials and specifications

are subject to change without notice.

Scale: -

Status: Released

Rev: A

Date: 10/01/07

Modified:

SG-BGA-6193 Drawing

11351 Rupp Dr. Suite 400, Burnsville MN 55337

Tele: (952) 229-8200

Drawing: J. Glab

File: SG-BGA-6193 Dwg

PAGE 1 of 5

www.ironwoodelectronics.com

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