Datasheet > SG-BGA-6155

SG-BGA-6155

更新时间： 2024-09-19 01:10:55

品牌	Logo	应用领域
IRONWOOD		/
页数	文件大小	规格书
4页	70K
描述
Compression plate distributes forces evenly

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中文翻译

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数据手册

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SG-BGA-6155 数据手册

GHz BGA Socket - Direct mount, solderless

Features

Directly mounts to target PCB (needs tooling holes) with hardware.

High speed, reliable Elastomer connection

Minimum real estate required

Compression plate distributes forces evenly

Ball guide prevents over compression of elastomer

Easily removable swivel socket lid

Socket Lid: Black anodized Aluminum.

Thickness = 2.5mm.

Socket base: Black anodized Aluminum.

Thickness = 5mm.

Top View

Compression Plate: Black anodized Aluminum.

Thickness = 2.5mm.

Compression screw: Clear anodized Aluminum.

Thickness = 5mm, Hex socket = 5mm.

Elastomer: 20 micron dia gold plated brass

filaments arranged symmetrically in a silicone

rubber (63.5 degree angle).

Thickness = 0.5mm.

Recommended torque = 1in lbs/

16in oz

Elastomer Guide: Non-clad FR4.

Thickness = 0.475mm.

Ball Guide: Dura-Lar oriented polyester

Assembled

8.25mm +

IC thickness

Socket base screw: Socket head cap, alloy steel with

black oxide finish, 0-80 fine thread , 9.525mm long.

Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine

thread.

Insulation Plate: FR4/G10, Thickness = 1.59mm.

Side View

(Section AA)

Backing Plate: Black anodized Aluminum.

Thickness = 6.35mm.

Customer's

BGA IC

Customer's Target PCB

IC Guide: Torlon

All tolerances: ±0.125mm (unless stated

otherwise). Materials and specifications

are subject to change without notice.

Scale: -

Status: Released

Rev: E

SG-BGA-7025 Drawing

PO BOX 21151 ST. PAUL, MN 55121

Tele: (651) 452-8100

Drawing: Heidi Hansen

File: SG-BGA-7025 Dwg.mcd

Date: 1/28/04

Modified: 11/11/14, DH

PAGE 1 of 4

www.ironwoodelectronics.com

*Note: BGA pattern is not symmetrical

Recommended PCB Layout

12 3 4

中文翻译

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