Datasheet > SG-BGA-6176

SG-BGA-6176

更新时间： 2024-09-19 00:33:03

品牌	Logo	应用领域
IRONWOOD		/
页数	文件大小	规格书
4页	104K
描述
Ball guide prevents over compression of elastomer

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中文翻译

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数据手册

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SG-BGA-6176 数据手册

20.4mm sqr.

GHz BGA Socket - Direct mount, solderless

Features

Directly mounts to target PCB (needs tooling holes) with hardware.

High speed, reliable Elastomer connection

Minimum real estate required

Top View

Compression plate distributes forces evenly

Ball guide prevents over compression of elastomer

Easily removable swivel socket lid

40.225mm

Socket Lid: Black anodized Aluminum.

Thickness = 2.5mm.

Socket base: Black anodized Aluminum.

Thickness = 6.5mm.

Compression Plate: Black anodized Aluminum.

Thickness = 2.5mm.

Compression screw: Clear anodized Aluminum.

Thickness = 5mm, Hex socket = 5mm.

40.225mm

Elastomer: 40 micron dia gold plated brass

filaments arranged symmetrically in a silicone

rubber (63.5 degree angle).

Thickness = 0.75mm.

Recommended torque = 1 in lbs. / screw

Side View

Elastomer Guide: Cirlex or equivalent.

Thickness = 0.75mm.

(Section AA)

20.4mm

15mm

Ball Guide: Kapton polyimide.

Socket base screw: Socket head cap, 18-8 Stainless

steel, 0-80 fine thread , 19.05mm long.

Assembled

8.25mm +

IC thickness

Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine

thread.

Insulation Plate: FR4/G10, Thickness = 1.59mm.

Backing Plate: Black anodized Aluminum.

Thickness = 6.35mm.

IC Frame: FR4

Customer's

BGA IC

Customer's Target PCB

All tolerances: ±0.125mm (unless stated

otherwise). Materials and specifications

are subject to change without notice.

Scale: -

Status: Released

Drawing: H. Hansen

File: SG-BGA-6176 Dwg

Rev: B

SG-BGA-6176 Drawing

11351 Rupp Drive, Suite 400, Burnsville, MN 55337

Tele: (952) 229-8200

Date: 3/22/06

Modified: 6/15/09, AE

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