Datasheet > SEMiX526D22p

SEMiX526D22p

更新时间： 2023-12-06 20:03:15

品牌	Logo	应用领域
赛米控丹佛斯 - SEMIKRON		/
页数	文件大小	规格书
5页	674K
描述
Bridge Rectifier Modules SEMiX 6p (122x62x17)

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SEMiX526D22p 数据手册

SEMiX526D22p

Absolute Maximum Ratings

Symbol Conditions

Module

Values

Unit

I_t(RMS)

T_stg

V_isol

per power terminal (50 A / pin)

650

-40 ... 125

4000

°C

AC sinus 50Hz, t = 1 min

Absolute Maximum Ratings

Symbol Conditions

Diode

Values

Unit

SEMiX^®6p

3-Phase Bridge Rectifier

SEMiX526D22p

T_c= 85 °C

T_c= 100 °C

T_j= 25 °C

T_j= 130 °C

T_j= 25 °C

T_j= 130 °C

I_FAV

I_FSM

i²t

384

318

5400

T_j= 150 °C

sin 180°

10 ms

sin 180°

5300

145800

140450

2300

2200

-40 ... 150

A²s

°C

10 ms

sin 180°

V_RSM

V_RRM

T_j

Features*

• Terminal height 17 mm

• Chips soldered directly to insulated

substrate

Characteristics

Symbol Conditions

Diode

• UL recognized file no. E63532

• Press-Fit pins

min.

typ.

max.

Unit

• NEW SKR PEP diode-technology for

enhanced power and environmental

robustness

T_j= 25 °C

T_j= 125 °C

T_j= 25 °C

T_j= 125 °C

T_j= 25 °C

V_F

1.00

0.91

1.12

1.09

0.90

1.10

1.01

1.28

1.25

0.97

I_F= 302 A

chiplevel

• T_jmax= 150°C

• NTC temperature sensor

V_F

I_F= 302 A

terminal level

chiplevel

Remarks

V_F0

Approximation for:

• Temperature sensor: no basic

insulation to main circuit, signal

processing with reference to negative

DC potential

I_F1= 302 A

_F2= 906 A

T_j= 125 °C

0.78

0.83

T_j= 25 °C

T_j= 125 °C

r_F

0.33

0.43

0.45

0.58

0.1

0.122

0.128

mΩ

K/W

chiplevel

• Product reliability results valid for T_j≤

130°C (recommended T_jop= -40 ...

130°C)

• All positive DC terminals have to be

connected externally to same potential

T_j= 150 °C, V_RRM

per diode, cont.

per diode, sin. 180°

per diode, rec. 120°

I_R

R_th(j-c)

R_th(c-s)

per diode (λ_grease=0.81 W/(m*K))

0.042

Characteristics

Symbol Conditions

Module

min.

typ.

max.

Unit

_C= 25 °C

_C= 125 °C

R_CC'+EE'

0.4

0.6

mΩ

measured per

switch

calculated without thermal coupling

(λ_grease=0.81 W/(m*K))

including thermal coupling,

T_sunderneath module (λ_grease=0.81 W/

(m*K))

R_th(c-s)1

R_th(c-s)2

0.007

K/W

0.011

K/W

M_s

to heat sink (M5)

300

Rev. 1.0 – 28.11.2019

12 3 4 5

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