SEMiX603GAL12E4p
Absolute Maximum Ratings
Symbol Conditions
IGBT
Values
Unit
Tj = 25 °C
VCES
IC
1200
1110
853
600
1800
V
A
A
A
A
V
Tc = 25 °C
Tc = 80 °C
Tj = 175 °C
ICnom
ICRM
VGES
ICRM = 3xICnom
VCC = 800 V
-20 ... 20
SEMiX® 3p
Trench IGBT Modules
SEMiX603GAL12E4p
Features
V
V
GE ≤ 15 V
CES ≤ 1200 V
Tj = 150 °C
tpsc
10
µs
°C
Tj
-40 ... 175
Inverse diode
Tj = 25 °C
VRRM
IF
1200
856
640
600
1200
V
A
A
A
A
Tc = 25 °C
Tc = 80 °C
Tj = 175 °C
IFnom
IFRM
IFSM
Tj
IFRM = 2xIFnom
tp = 10 ms, sin 180°, Tj = 25 °C
• Homogeneous Si
3456
-40 ... 175
A
°C
• Trench = Trenchgate technology
• VCE(sat) with positive temperature
coefficient
• High short circuit capability
• Press-fit pins as auxiliary contacts
• Thermally optimized ceramic
• UL recognized, file no. E63532
Freewheeling diode
Tj = 25 °C
VRRM
IF
1200
856
640
600
1200
V
A
A
A
A
Tc = 25 °C
Tc = 80 °C
Tj = 175 °C
IFnom
IFRM
IFSM
Tj
Typical Applications*
IFRM = 2xIFnom
tp = 10 ms, sin 180°, Tj = 25 °C
• AC inverter drives
• UPS
3456
-40 ... 175
A
°C
• Renewable energy systems
Module
It(RMS)
Tstg
Remarks
600
-40 ... 125
4000
A
°C
V
• Product reliability results are valid for
Tj=150°C
module without TIM
AC sinus 50Hz, t = 1 min
• Visol between temperature sensor and
power section is only 2500V
• For storage and case temperature with
TIM see document “TP(*) SEMiX 3p”
Visol
Characteristics
Symbol Conditions
IGBT
min.
typ.
max.
Unit
IC = 600 A
Tj = 25 °C
VCE(sat)
1.80
2.03
2.05
2.30
V
V
V
GE = 15 V
Tj = 150 °C
chiplevel
Tj = 25 °C
Tj = 150 °C
Tj = 25 °C
Tj = 150 °C
VCE0
rCE
0.87
0.77
1.55
2.1
1.01
0.9
1.73
2.3
6.3
5
V
V
mΩ
mΩ
V
mA
nF
nF
nF
nC
Ω
chiplevel
VGE = 15 V
chiplevel
VGE(th)
ICES
Cies
Coes
Cres
QG
VGE=VCE, IC = 22.2 mA
VGE = 0 V, VCE = 1200 V, Tj = 25 °C
f = 1 MHz
5.3
5.8
37.5
2.31
2.04
3450
1.2
VCE = 25 V
f = 1 MHz
f = 1 MHz
V
GE = 0 V
VGE = - 8 V...+ 15 V
Tj = 25 °C
RGint
GAL
© by SEMIKRON
Rev. 1.0 – 24.11.2017
1