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S73WS256NDEBFWAB3 PDF预览

S73WS256NDEBFWAB3

更新时间: 2024-11-18 03:34:03
品牌 Logo 应用领域
飞索 - SPANSION /
页数 文件大小 规格书
251页 5244K
描述
Stacked Multi-Chip Product (MCP)

S73WS256NDEBFWAB3 数据手册

 浏览型号S73WS256NDEBFWAB3的Datasheet PDF文件第2页浏览型号S73WS256NDEBFWAB3的Datasheet PDF文件第3页浏览型号S73WS256NDEBFWAB3的Datasheet PDF文件第4页浏览型号S73WS256NDEBFWAB3的Datasheet PDF文件第5页浏览型号S73WS256NDEBFWAB3的Datasheet PDF文件第6页浏览型号S73WS256NDEBFWAB3的Datasheet PDF文件第7页 
S73WS256N Based MCPs  
Stacked Multi-Chip Product (MCP)  
512/256 Megabit (32M/16M x 16-bit) CMOS 1.8 Volt-only,  
Simultaneous Read/Write, Burst Mode Flash Memory with  
256/128 Megabit (4M/2M x 16-bit x 4 Banks) Mobile SDRAM  
on Shared Data Bus  
ADVANCE  
INFORMATION  
Data Sheet  
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Publication Number S73WS256N_00 Revision A Amendment 3 Issue Date December 16, 2005  

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