Datasheet > S73WS256NEEBFWAB3

S73WS256NEEBFWAB3

更新时间： 2024-11-21 03:34:03

品牌	Logo	应用领域
飞索 - SPANSION		/
页数	文件大小	规格书
251页	5244K
描述
Stacked Multi-Chip Product (MCP)

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S73WS256NEEBFWAB3 数据手册

S73WS256N Based MCPs

Stacked Multi-Chip Product (MCP)

512/256 Megabit (32M/16M x 16-bit) CMOS 1.8 Volt-only,

Simultaneous Read/Write, Burst Mode Flash Memory with

256/128 Megabit (4M/2M x 16-bit x 4 Banks) Mobile SDRAM

on Shared Data Bus

ADVANCE

INFORMATION

Data Sheet

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Publication Number S73WS256N_00 Revision A Amendment 3 Issue Date December 16, 2005

12 3 4 5 6 7...251

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型号	品牌	获取价格	描述	数据表
S73WS256NEEBFWT70	SPANSION	获取价格	Stacked Multi-Chip Product (MCP)
S73WS256NEEBFWT72	SPANSION	获取价格	Stacked Multi-Chip Product (MCP)
S73WS256NEEBFWT73	SPANSION	获取价格	Stacked Multi-Chip Product (MCP)
S73WS256NEEBFWTB0	SPANSION	获取价格	Stacked Multi-Chip Product (MCP)
S73WS256NEEBFWTB2	SPANSION	获取价格	Stacked Multi-Chip Product (MCP)
S73WS256NEEBFWTB3	SPANSION	获取价格	Stacked Multi-Chip Product (MCP)
S73WS512PD0HF64V0	SPANSION	获取价格	Memory Circuit, 32MX16, CMOS, PBGA137, 9 X 12 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-137
S73WS512PD0HF64V2	SPANSION	获取价格	Memory Circuit, 32MX16, CMOS, PBGA137, 9 X 12 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-137
S73WS512PD0HF64V3	SPANSION	获取价格	Memory Circuit, 32MX16, CMOS, PBGA137, 9 X 12 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-137
S73WS-P	SPANSION	获取价格	Stacked Multi-Chip Product (MCP)