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RN2130MFV PDF预览

RN2130MFV

更新时间: 2024-11-11 12:23:03
品牌 Logo 应用领域
东芝 - TOSHIBA 驱动器开关
页数 文件大小 规格书
5页 160K
描述
Switching Applications Inverter Circuit Applications Interface Circuit Applications Driver Circuit Applications

RN2130MFV 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:SMALL OUTLINE, R-PDSO-F3针数:3
Reach Compliance Code:unknownECCN代码:EAR99
风险等级:5.74其他特性:BUILT-IN BIAS RESISTOR RATIO IS 1
最大集电极电流 (IC):0.1 A集电极-发射极最大电压:50 V
配置:SINGLE WITH BUILT-IN RESISTOR最小直流电流增益 (hFE):100
JESD-30 代码:R-PDSO-F3元件数量:1
端子数量:3最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:PNP认证状态:Not Qualified
表面贴装:YES端子形式:FLAT
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

RN2130MFV 数据手册

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RN2130MFV  
TOSHIBA Transistor Silicon PNP Epitaxial Type (PCT Process) (Bias Resistor built-in Transistor)  
RN2130MFV  
Switching Applications  
Unit : mm  
Inverter Circuit Applications  
Interface Circuit Applications  
Driver Circuit Applications  
1.2±0.05  
z
z
z
z
With built-in bias resistors  
0.8±0.05  
Simplify circuit design  
Reduce a quantity of parts and manufacturing process  
Complementary to RN1130MFV  
1
2
3
Equivalent Circuit  
1.BASE  
2.EMITTER  
3.COLLECTOR  
VESM  
JEDEC  
JEITA  
Absolute Maximum Ratings (Ta = 25°C)  
2-1L1A  
TOSHIBA  
Weight : 1.5 mg (typ.)  
Characteristic  
Collector-base voltage  
Symbol  
Rating  
Unit  
V
CBO  
V
CEO  
V
EBO  
50  
50  
V
V
Collector-emitter voltage  
Emitter-base voltage  
10  
V
Collector current  
I
100  
150  
mA  
mW  
°C  
°C  
C
Collector power dissipation  
Junction temperature  
Storage temperature range  
P
(Note1)  
C
T
150  
j
T
stg  
55 to 150  
Note1: Mounted on FR4 board (25.4 mm × 25.4 mm × 1.6 mmt)  
Note2: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the  
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even  
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum  
ratings.  
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook  
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test  
report and estimated failure rate, etc).  
Land Pattern Example  
Unit: mm  
0.5  
0.45  
1.15  
0.4  
0.45  
0.4  
0.4  
1
2010-05-19  

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