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RN2112MFV PDF预览

RN2112MFV

更新时间: 2024-11-11 12:23:03
品牌 Logo 应用领域
东芝 - TOSHIBA 开关驱动
页数 文件大小 规格书
6页 297K
描述
Switching, Inverter Circuit, Interface Circuit and Driver Circuit Applications

RN2112MFV 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active包装说明:SMALL OUTLINE, R-PDSO-F3
针数:3Reach Compliance Code:unknown
ECCN代码:EAR99风险等级:5.46
其他特性:BUILT-IN BIAS RESISTOR RATIO IS 1最大集电极电流 (IC):0.1 A
集电极-发射极最大电压:50 V配置:SINGLE WITH BUILT-IN RESISTOR
最小直流电流增益 (hFE):120JESD-30 代码:R-PDSO-F3
元件数量:1端子数量:3
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:PNP
最大功率耗散 (Abs):0.15 W认证状态:Not Qualified
子类别:BIP General Purpose Small Signal表面贴装:YES
端子形式:FLAT端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

RN2112MFV 数据手册

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RN2112MFV,RN2113MFV  
TOSHIBA Transistor Silicon PNP Epitaxial Type (PCT Process) (Bias Resistor built-in Transistor)  
RN2112MFV,RN2113MFV  
Switching, Inverter Circuit, Interface Circuit and  
Driver Circuit Applications  
Unit: mm  
1.2±0.05  
z
z
Ultra-small package, suited to very high density mounting  
0.8±0.05  
Incorporating a bias resistor into the transistor reduces the number of  
parts, so enabling the manufacture of ever more compact equipment and  
lowering assembly cost.  
1
2
z
z
A wide range of resistor values is available for use in various circuits.  
Complementary to the RN1112MFV and RN1113MFV  
3
Equivalent Circuit  
1. BASE  
VESM  
2. EMITTER  
3. COLLECTOR  
Absolute Maximum Ratings (Ta = 25°C)  
JEDEC  
JEITA  
Characteristic  
Collector-base voltage  
Symbol  
Rating  
50  
Unit  
V
TOSHIBA  
2-1L1A  
V
CBO  
V
CEO  
V
EBO  
Weight: 1.5 mg (typ.)  
Collector-emitter voltage  
Emitter-base voltage  
50  
V
5  
V
Collector current  
I
100  
150  
mA  
mW  
°C  
°C  
C
Collector power dissipation  
Junction temperature  
Storage temperature range  
P (Note 1)  
C
T
150  
j
T
stg  
55 to 150  
Note:  
Using continuously under heavy loads (e.g. the application of high  
temperature/current/voltage and the significant change in temperature, etc.) may  
cause this product to decrease in the reliability significantly even if the operating  
conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute  
maximum ratings.  
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor  
Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and  
individual reliability data (i.e. reliability test report and estimated failure rate, etc).  
Note 1: Mounted on an FR4 board (25.4 mm × 25.4 mm × 1.6 mmt)  
Land Pattern Example  
Unit:mm  
0.5  
0.45  
1.15  
0.4  
0.45  
0.4  
0.4  
1
2010-05-21  

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