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RN1112MFV PDF预览

RN1112MFV

更新时间: 2024-02-19 08:37:31
品牌 Logo 应用领域
东芝 - TOSHIBA 开关光电二极管晶体管
页数 文件大小 规格书
6页 281K
描述
TRANSISTOR 100 mA, 50 V, NPN, Si, SMALL SIGNAL TRANSISTOR, LEAD FREE, 2-1L1A, VESM, 3 PIN, BIP General Purpose Small Signal

RN1112MFV 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active包装说明:SMALL OUTLINE, R-PDSO-F3
针数:3Reach Compliance Code:unknown
ECCN代码:EAR99风险等级:5.47
其他特性:BUILT-IN BIAS RESISTOR最大集电极电流 (IC):0.1 A
集电极-发射极最大电压:50 V配置:SINGLE WITH BUILT-IN RESISTOR
最小直流电流增益 (hFE):120JESD-30 代码:R-PDSO-F3
元件数量:1端子数量:3
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:NPN
最大功率耗散 (Abs):0.15 W认证状态:Not Qualified
子类别:BIP General Purpose Small Signal表面贴装:YES
端子形式:FLAT端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

RN1112MFV 数据手册

 浏览型号RN1112MFV的Datasheet PDF文件第2页浏览型号RN1112MFV的Datasheet PDF文件第3页浏览型号RN1112MFV的Datasheet PDF文件第4页浏览型号RN1112MFV的Datasheet PDF文件第5页浏览型号RN1112MFV的Datasheet PDF文件第6页 
RN1112MFV,RN1113MFV  
TOSHIBA Transistor Silicon NPN Epitaxial Type (PCT Process)  
(Bias Resistor built-in Transistor)  
RN1112MFV,RN1113MFV  
Unit: mm  
Switching, Inverter Circuit, Interface Circuit and  
1.2 ± 0.05  
Driver Circuit Applications  
0.80 ± 0.05  
z
z
Ultra-small package, suited to very high density mounting  
1
Incorporating a bias resistor into the transistor reduces the number of  
parts, so enabling the manufacture of ever more compact equipment and  
lowering assembly cost.  
3
2
z
z
A wide range of resistor values is available for use in various circuits.  
Complementary to the RN2112MFV to RN2113MFV  
Equivalent Circuit  
1. BASE  
2. EMITTER  
VESM  
3. COLLECTOR  
JEDEC  
JEITA  
Absolute Maximum Ratings (Ta = 25°C)  
TOSHIBA  
2-1L1A  
Weight: 1.5 mg (typ.)  
Characteristic  
Collector-base voltage  
Symbol  
Rating  
Unit  
V
CBO  
V
CEO  
V
EBO  
50  
50  
V
V
Collector-emitter voltage  
Emitter-base voltage  
5
V
Collector current  
I
100  
mA  
mW  
°C  
°C  
C
Collector power dissipation  
Junction temperature  
Storage temperature range  
P
(Note 1)  
150  
C
T
150  
j
T
stg  
55 to 150  
Note:  
Using continuously under heavy loads (e.g. the application of high  
temperature/current/voltage and the significant change in temperature, etc.)  
may cause this product to decrease in the reliability significantly even if the  
operating conditions (i.e. operating temperature/current/voltage, etc.) are  
within the absolute maximum ratings.  
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook  
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test  
report and estimated failure rate, etc).  
Note 1: Mounted on an FR4 board (25.4 mm × 25.4 mm × 1.6 mmt)  
Pad DimensionReference)  
Unitmm  
0.5  
0.45  
1.15  
0.4  
0.45  
0.4  
0.4  
1
2010-05-12  

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