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RN1113ACT PDF预览

RN1113ACT

更新时间: 2024-09-21 12:23:03
品牌 Logo 应用领域
东芝 - TOSHIBA 驱动器开关
页数 文件大小 规格书
6页 160K
描述
Switching Applications Inverter Circuit Applications Interface Circuit Applications Driver Circuit Applications

RN1113ACT 技术参数

生命周期:Lifetime Buy包装说明:CHIP CARRIER, R-XBCC-N3
针数:3Reach Compliance Code:unknown
ECCN代码:EAR99风险等级:5.71
其他特性:BUILT-IN BIAS RESISTOR外壳连接:COLLECTOR
最大集电极电流 (IC):0.08 A集电极-发射极最大电压:50 V
配置:SINGLE WITH BUILT-IN RESISTOR最小直流电流增益 (hFE):120
JESD-30 代码:R-XBCC-N3元件数量:1
端子数量:3封装主体材料:UNSPECIFIED
封装形状:RECTANGULAR封装形式:CHIP CARRIER
极性/信道类型:NPN认证状态:Not Qualified
表面贴装:YES端子形式:NO LEAD
端子位置:BOTTOM晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

RN1113ACT 数据手册

 浏览型号RN1113ACT的Datasheet PDF文件第2页浏览型号RN1113ACT的Datasheet PDF文件第3页浏览型号RN1113ACT的Datasheet PDF文件第4页浏览型号RN1113ACT的Datasheet PDF文件第5页浏览型号RN1113ACT的Datasheet PDF文件第6页 
RN1112ACT, RN1113ACT  
TOSHIBA Transistor Silicon NPN Epitaxial Type (PCT process) (Bias Resistor built-in Transistor)  
RN1112ACT,RN1113ACT  
Switching Applications  
Unit: mm  
Inverter Circuit Applications  
Interface Circuit Applications  
Driver Circuit Applications  
0.6±0.05  
0.5±0.03  
Incorporating a bias resistor into a transistor reduces the number of parts,  
which enables the manufacture of ever more compact equipment and  
saves assembly cost.  
Complementary to RN2112ACT, RN2113ACT  
0.05±0.03  
0.35±0.02  
0.15±0.03  
Equivalent Circuit and Bias Resistor Values  
1.BASE  
2.EMITTER  
CST3  
3.COLLECOTR  
JEDEC  
JEITA  
Absolute Maximum Ratings (Ta = 25°C)  
Characteristics  
Collector-base voltage  
Symbol  
Rating  
Unit  
TOSHIBA  
2-1J1A  
Weight:0.75 mg (typ.)  
V
CBO  
V
CEO  
V
EBO  
50  
V
V
Collector-emitter voltage  
Emitter-base voltage  
50  
5
80  
V
Collector current  
I
mA  
mW  
°C  
°C  
C
Collector power dissipation  
Junction temperature  
Storage temperature range  
P
(Note1)  
100  
C
T
j
150  
T
stg  
55 to 150  
Note1: Mounted on FR4 board (10 mm × 10 mm × 1 mmt)  
Note2: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the  
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even  
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum  
ratings.  
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook  
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test  
report and estimated failure rate, etc).  
1
2009-04-13  

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