R5F2138CWKFP

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R5F2138CWKFP 技术参数

生命周期：	Not Recommended	零件包装代码：	QFP
包装说明：	LFQFP, QFP80,.55SQ,20	针数：	80
Reach Compliance Code：	compliant	HTS代码：	8542.31.00.01
风险等级：	5.65	具有ADC：	YES
地址总线宽度：		位大小：	32
CPU系列：	R8C	最大时钟频率：	20 MHz
DAC 通道：	NO	DMA 通道：	NO
外部数据总线宽度：		JESD-30 代码：	S-PQFP-G80
长度：	12 mm	I/O 线路数量：	76
端子数量：	80	最高工作温度：	125 °C
最低工作温度：	-40 °C	PWM 通道：	YES
封装主体材料：	PLASTIC/EPOXY	封装代码：	LFQFP
封装等效代码：	QFP80,.55SQ,20	封装形状：	SQUARE
封装形式：	FLATPACK, LOW PROFILE, FINE PITCH	电源：	3/5 V
认证状态：	Not Qualified	RAM（字节）：	10240
ROM（单词）：	131072	ROM可编程性：	FLASH
座面最大高度：	1.7 mm	速度：	20 MHz
子类别：	Microcontrollers	最大压摆率：	15 mA
最大供电电压：	5.5 V	最小供电电压：	2.7 V
标称供电电压：	3 V	表面贴装：	YES
技术：	CMOS	温度等级：	AUTOMOTIVE
端子形式：	GULL WING	端子节距：	0.5 mm
端子位置：	QUAD	宽度：	12 mm
uPs/uCs/外围集成电路类型：	MICROCONTROLLER

Preliminary DATASHEET

Specifications in this document are tentative and subject to change.

R8C/38W Group, R8C/38X Group, R8C/38Y Group, R8C/38Z Group

REJ03B0317-0010

Rev.0.10

RENESAS MCU

May 31, 2010

1. Overview

1.1

Features

The R8C/38W Group, R8C/38X Group, R8C/38Y Group, and R8C/38Z Group of single-chip MCUs incorporate

the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1 Mbyte of address

space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for

high-speed operation processing.

Power consumption is low, and the supported operating modes allow additional power control. These MCUs are

designed to maximize EMI/EMS performance.

Integration of many peripheral functions, including multifunction timer and serial interface, reduces the number of

system components.

The R8C/38W Group and R8C/38X Group have a single channel CAN module and are suitable for LAN systems in

vehicles and for FA.

The R8C/38Y Group and R8C/38Z Group do not have CAN modules.

The R8C/38W Group and R8C/38Y Group have data flash (1 KB × 4 blocks) with the background operation

(BGO) function.

1.1.1

Applications

Automobiles and others

REJ03B0317-0010 Rev.0.10

May 31, 2010

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