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R5F213G1CNSP PDF预览

R5F213G1CNSP

更新时间: 2024-11-04 06:06:27
品牌 Logo 应用领域
瑞萨 - RENESAS /
页数 文件大小 规格书
59页 644K
描述
RENESAS MCU

R5F213G1CNSP 技术参数

生命周期:ObsoleteReach Compliance Code:compliant
风险等级:5.82技术:CMOS
uPs/uCs/外围集成电路类型:MICROCONTROLLER

R5F213G1CNSP 数据手册

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Preliminary DATASHEET  
Specifications in this document are tentative and subject to change.  
R8C/3GC Group  
RENESAS MCU  
REJ03B0301-0010  
Rev.0.10  
May 24, 2010  
1.Overview  
1.1  
Features  
The R8C/3GC Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions  
for a high level of efficiency. With 1 Mbyte of address space, and it is capable of executing instructions at high  
speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.  
Power consumption is low, and the supported operating modes allow additional power control. These MCUs are  
designed to maximize EMI/EMS performance.  
Integration of many peripheral functions, including multifunction timer and serial interface, reduces the number of  
system components.  
The R8C/3GC Group has data flash (1 KB × 4 blocks) with the background operation (BGO) function.  
1.1.1  
Applications  
Electronic household appliances, office equipment, audio equipment, consumer equipment, etc.  
REJ03B0301-0010 Rev.0.10  
May 24, 2010  
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