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R5F21335CDFP PDF预览

R5F21335CDFP

更新时间: 2024-11-03 11:48:51
品牌 Logo 应用领域
瑞萨 - RENESAS 微控制器和处理器外围集成电路时钟
页数 文件大小 规格书
56页 507K
描述
RENESAS MCU

R5F21335CDFP 技术参数

生命周期:Not Recommended零件包装代码:QFP
包装说明:LQFP,针数:32
Reach Compliance Code:compliantHTS代码:8542.31.00.01
风险等级:5.29Is Samacsys:N
具有ADC:YES其他特性:IT ALSO OPERATES MINI 1.8 VOLT AT 5 MHZ
地址总线宽度:位大小:8
最大时钟频率:20 MHzDAC 通道:YES
DMA 通道:NO外部数据总线宽度:
JESD-30 代码:S-PQFP-G32长度:7 mm
I/O 线路数量:28端子数量:32
最高工作温度:85 °C最低工作温度:-40 °C
PWM 通道:YES封装主体材料:PLASTIC/EPOXY
封装代码:LQFP封装形状:SQUARE
封装形式:FLATPACK, LOW PROFILE认证状态:Not Qualified
ROM可编程性:FLASH座面最大高度:1.7 mm
速度:20 MHz最大供电电压:5.5 V
最小供电电压:2.7 V标称供电电压:3 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子形式:GULL WING
端子节距:0.8 mm端子位置:QUAD
宽度:7 mmuPs/uCs/外围集成电路类型:MICROCONTROLLER
Base Number Matches:1

R5F21335CDFP 数据手册

 浏览型号R5F21335CDFP的Datasheet PDF文件第2页浏览型号R5F21335CDFP的Datasheet PDF文件第3页浏览型号R5F21335CDFP的Datasheet PDF文件第4页浏览型号R5F21335CDFP的Datasheet PDF文件第5页浏览型号R5F21335CDFP的Datasheet PDF文件第6页浏览型号R5F21335CDFP的Datasheet PDF文件第7页 
Datasheet  
R8C/33C Group  
RENESAS MCU  
R01DS0008EJ0100  
Rev 1.00  
Aug. 24, 2010  
1. Overview  
1.1  
Features  
The R8C/33C Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions  
for a high level of efficiency. With 1 Mbyte of address space, and it is capable of executing instructions at high  
speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.  
Power consumption is low, and the supported operating modes allow additional power control. These MCUs are  
designed to maximize EMI/EMS performance.  
Integration of many peripheral functions, including multifunction timer and serial interface, reduces the number of  
system components.  
The R8C/33C Group has data flash (1 KB × 4 blocks) with the background operation (BGO) function.  
1.1.1  
Applications  
Electronic household appliances, office equipment, audio equipment, consumer equipment, etc.  
R01DS0008EJ0100 Rev 1.00  
Aug. 24, 2010  
Page 1 of 53  

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