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R5F21336GJFP

更新时间: 2024-11-03 07:20:15
品牌 Logo 应用领域
瑞萨 - RENESAS /
页数 文件大小 规格书
57页 515K
描述
RENESAS MCU

R5F21336GJFP 技术参数

生命周期:Not Recommended包装说明:QFP,
Reach Compliance Code:compliant风险等级:5.73
具有ADC:YES地址总线宽度:
位大小:16最大时钟频率:20 MHz
DMA 通道:NO外部数据总线宽度:
长度:7 mmI/O 线路数量:27
端子数量:32PWM 通道:YES
封装代码:QFP封装形状:SQUARE
封装形式:FLATPACKROM(单词):32768
速度:20 MHz最大供电电压:5.5 V
最小供电电压:2.7 V标称供电电压:3.3 V
表面贴装:YES技术:CMOS
端子形式:GULL WING端子节距:0.8 mm
端子位置:QUAD宽度:7 mm
uPs/uCs/外围集成电路类型:MICROCONTROLLER

R5F21336GJFP 数据手册

 浏览型号R5F21336GJFP的Datasheet PDF文件第2页浏览型号R5F21336GJFP的Datasheet PDF文件第3页浏览型号R5F21336GJFP的Datasheet PDF文件第4页浏览型号R5F21336GJFP的Datasheet PDF文件第5页浏览型号R5F21336GJFP的Datasheet PDF文件第6页浏览型号R5F21336GJFP的Datasheet PDF文件第7页 
Datasheet  
R8C/33G Group, R8C/33H Group  
RENESAS MCU  
R01DS0091EJ0100  
Rev.1.00  
Jul. 05, 2011  
1. Overview  
1.1  
Features  
The R8C/33G Group, R8C/33H Group of single-chip MCUs incorporates the R8C CPU core, employing  
sophisticated instructions for a high level of efficiency. With 1 Mbyte of address space, and it is capable of  
executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation  
processing.  
Power consumption is low, and the supported operating modes allow additional power control. These MCUs are  
designed to maximize EMI/EMS performance.  
Integration of many peripheral functions, including multifunction timer and serial interface, reduces the number of  
system components.  
The R8C/33G Group has data flash (1 KB × 4 blocks) with the background operation (BGO) function.  
1.1.1  
Applications  
Automobiles and others  
R01DS0091EJ0100 Rev.1.00  
Jul. 05, 2011  
Page 1 of 54  

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