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R5F21346MNFP PDF预览

R5F21346MNFP

更新时间: 2024-11-03 09:40:03
品牌 Logo 应用领域
瑞萨 - RENESAS /
页数 文件大小 规格书
57页 539K
描述
Specifications in this document are tentative and subject to change

R5F21346MNFP 技术参数

生命周期:Obsolete包装说明:QFP, QFP48,.35SQ,20
Reach Compliance Code:compliant风险等级:5.66
位大小:16CPU系列:R8C
JESD-30 代码:S-PQFP-G48端子数量:48
最高工作温度:85 °C最低工作温度:-20 °C
封装主体材料:PLASTIC/EPOXY封装代码:QFP
封装等效代码:QFP48,.35SQ,20封装形状:SQUARE
封装形式:FLATPACK电源:2/5 V
认证状态:Not QualifiedRAM(字节):2560
ROM(单词):32768ROM可编程性:FLASH
速度:20 MHz子类别:Microcontrollers
最大压摆率:15 mA表面贴装:YES
技术:CMOS温度等级:OTHER
端子形式:GULL WING端子节距:0.5 mm
端子位置:QUADuPs/uCs/外围集成电路类型:MICROCONTROLLER
Base Number Matches:1

R5F21346MNFP 数据手册

 浏览型号R5F21346MNFP的Datasheet PDF文件第2页浏览型号R5F21346MNFP的Datasheet PDF文件第3页浏览型号R5F21346MNFP的Datasheet PDF文件第4页浏览型号R5F21346MNFP的Datasheet PDF文件第5页浏览型号R5F21346MNFP的Datasheet PDF文件第6页浏览型号R5F21346MNFP的Datasheet PDF文件第7页 
Preliminary Datasheet  
Specifications in this document are tentative and subject to change.  
R8C/34M Group  
RENESAS MCU  
R01DS0022EJ0020  
Rev.0.20  
Feb 15, 2011  
1. Overview  
1.1  
Features  
The R8C/34M Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions  
for a high level of efficiency. With 1 Mbyte of address space, and it is capable of executing instructions at high  
speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.  
Power consumption is low, and the supported operating modes allow additional power control. These MCUs are  
designed to maximize EMI/EMS performance.  
Integration of many peripheral functions, including multifunction timer and serial interface, reduces the number of  
system components.  
The R8C/34M Group has data flash (1 KB × 4 blocks) with the background operation (BGO) function.  
1.1.1  
Applications  
Electronic household appliances, office equipment, audio equipment, consumer equipment, etc.  
R01DS0022EJ0020 Rev.0.20  
Feb 15, 2011  
Page 1 of 54  

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