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R5F21336GKFP

更新时间: 2024-11-03 06:06:27
品牌 Logo 应用领域
瑞萨 - RENESAS /
页数 文件大小 规格书
54页 485K
描述
RENESAS MCU

R5F21336GKFP 技术参数

生命周期:Not Recommended包装说明:QFP,
Reach Compliance Code:compliantHTS代码:8542.31.00.01
风险等级:5.73具有ADC:YES
地址总线宽度:位大小:16
最大时钟频率:20 MHzDMA 通道:NO
外部数据总线宽度:长度:7 mm
I/O 线路数量:27端子数量:32
PWM 通道:YES封装代码:QFP
封装形状:SQUARE封装形式:FLATPACK
ROM(单词):32768速度:20 MHz
最大供电电压:5.5 V最小供电电压:2.7 V
标称供电电压:3.3 V表面贴装:YES
技术:CMOS端子形式:GULL WING
端子节距:0.8 mm端子位置:QUAD
宽度:7 mmuPs/uCs/外围集成电路类型:MICROCONTROLLER
Base Number Matches:1

R5F21336GKFP 数据手册

 浏览型号R5F21336GKFP的Datasheet PDF文件第2页浏览型号R5F21336GKFP的Datasheet PDF文件第3页浏览型号R5F21336GKFP的Datasheet PDF文件第4页浏览型号R5F21336GKFP的Datasheet PDF文件第5页浏览型号R5F21336GKFP的Datasheet PDF文件第6页浏览型号R5F21336GKFP的Datasheet PDF文件第7页 
Preliminary Datasheet  
Specifications in this document are tentative and subject to change.  
R8C/33G Group, R8C/33H Group  
RENESAS MCU  
REJ03B0306-0010  
Rev.0.10  
Jul. 21, 2010  
1. Overview  
1.1  
Features  
The R8C/33G Group, R8C/33H Group of single-chip MCUs incorporates the R8C CPU core, employing  
sophisticated instructions for a high level of efficiency. With 1 Mbyte of address space, and it is capable of  
executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation  
processing.  
Power consumption is low, and the supported operating modes allow additional power control. These MCUs are  
designed to maximize EMI/EMS performance.  
Integration of many peripheral functions, including multifunction timer and serial interface, reduces the number of  
system components.  
The R8C/33G Group has data flash (1 KB × 4 blocks) with the background operation (BGO) function.  
1.1.1  
Applications  
Automobiles and others  
REJ03B0306-0010 Rev.0.10  
Jul. 21, 2010  
Page 1 of 51  

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