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R5F21336DNFP PDF预览

R5F21336DNFP

更新时间: 2024-11-03 06:06:27
品牌 Logo 应用领域
瑞萨 - RENESAS /
页数 文件大小 规格书
45页 406K
描述
RENESAS MCU

R5F21336DNFP 技术参数

生命周期:Not Recommended零件包装代码:QFP
包装说明:LQFP, QFP32,.35SQ,32针数:32
Reach Compliance Code:compliantHTS代码:8542.31.00.01
风险等级:5.29具有ADC:YES
其他特性:IT ALSO OPERATES 1.8 V AT 5MHZ地址总线宽度:
位大小:8最大时钟频率:20 MHz
DAC 通道:NODMA 通道:NO
外部数据总线宽度:JESD-30 代码:S-PQFP-G32
长度:7 mmI/O 线路数量:28
端子数量:32最高工作温度:85 °C
最低工作温度:-20 °CPWM 通道:YES
封装主体材料:PLASTIC/EPOXY封装代码:LQFP
封装等效代码:QFP32,.35SQ,32封装形状:SQUARE
封装形式:FLATPACK, LOW PROFILE电源:2/5 V
认证状态:Not QualifiedRAM(字节):1024
ROM(单词):32768ROM可编程性:FLASH
座面最大高度:1.7 mm速度:20 MHz
子类别:Microcontrollers最大压摆率:15 mA
最大供电电压:5.5 V最小供电电压:2.7 V
标称供电电压:3 V表面贴装:YES
技术:CMOS温度等级:OTHER
端子形式:GULL WING端子节距:0.8 mm
端子位置:QUAD宽度:7 mm
uPs/uCs/外围集成电路类型:MICROCONTROLLERBase Number Matches:1

R5F21336DNFP 数据手册

 浏览型号R5F21336DNFP的Datasheet PDF文件第2页浏览型号R5F21336DNFP的Datasheet PDF文件第3页浏览型号R5F21336DNFP的Datasheet PDF文件第4页浏览型号R5F21336DNFP的Datasheet PDF文件第5页浏览型号R5F21336DNFP的Datasheet PDF文件第6页浏览型号R5F21336DNFP的Datasheet PDF文件第7页 
Datasheet  
R8C/33D Group  
RENESAS MCU  
REJ03B0287-0100  
Rev.1.00  
Mar 31, 2010  
1. Overview  
1.1  
Features  
The R8C/33D Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions  
for a high level of efficiency. With 1 Mbyte of address space, and it is capable of executing instructions at high  
speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.  
Power consumption is low, and the supported operating modes allow additional power control. These MCUs are  
designed to maximize EMI/EMS performance.  
Integration of many peripheral functions, including multifunction timer and serial interface, reduces the number of  
system components.  
1.1.1  
Applications  
Electronic household appliances, office equipment, audio equipment, consumer equipment, etc.  
REJ03B0287-0100 Rev.1.00  
Mar 31, 2010  
Page 1 of 42  

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