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R5F21335DNFP PDF预览

R5F21335DNFP

更新时间: 2024-11-03 11:52:35
品牌 Logo 应用领域
瑞萨 - RENESAS 微控制器和处理器外围集成电路时钟
页数 文件大小 规格书
45页 406K
描述
RENESAS MCU

R5F21335DNFP 技术参数

生命周期:Obsolete零件包装代码:QFP
包装说明:LQFP, QFP32,.35SQ,32针数:32
Reach Compliance Code:compliantHTS代码:8542.31.00.01
风险等级:5.43Is Samacsys:N
具有ADC:YES其他特性:IT ALSO OPERATES 1.8 V AT 5MHZ
地址总线宽度:位大小:8
最大时钟频率:20 MHzDAC 通道:NO
DMA 通道:NO外部数据总线宽度:
JESD-30 代码:S-PQFP-G32长度:7 mm
I/O 线路数量:28端子数量:32
最高工作温度:85 °C最低工作温度:-20 °C
PWM 通道:YES封装主体材料:PLASTIC/EPOXY
封装代码:LQFP封装等效代码:QFP32,.35SQ,32
封装形状:SQUARE封装形式:FLATPACK, LOW PROFILE
电源:2/5 V认证状态:Not Qualified
RAM(字节):1024ROM(单词):24576
ROM可编程性:FLASH座面最大高度:1.7 mm
速度:20 MHz子类别:Microcontrollers
最大压摆率:15 mA最大供电电压:5.5 V
最小供电电压:2.7 V标称供电电压:3 V
表面贴装:YES技术:CMOS
温度等级:OTHER端子形式:GULL WING
端子节距:0.8 mm端子位置:QUAD
宽度:7 mmuPs/uCs/外围集成电路类型:MICROCONTROLLER
Base Number Matches:1

R5F21335DNFP 数据手册

 浏览型号R5F21335DNFP的Datasheet PDF文件第2页浏览型号R5F21335DNFP的Datasheet PDF文件第3页浏览型号R5F21335DNFP的Datasheet PDF文件第4页浏览型号R5F21335DNFP的Datasheet PDF文件第5页浏览型号R5F21335DNFP的Datasheet PDF文件第6页浏览型号R5F21335DNFP的Datasheet PDF文件第7页 
Datasheet  
R8C/33D Group  
RENESAS MCU  
REJ03B0287-0100  
Rev.1.00  
Mar 31, 2010  
1. Overview  
1.1  
Features  
The R8C/33D Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions  
for a high level of efficiency. With 1 Mbyte of address space, and it is capable of executing instructions at high  
speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.  
Power consumption is low, and the supported operating modes allow additional power control. These MCUs are  
designed to maximize EMI/EMS performance.  
Integration of many peripheral functions, including multifunction timer and serial interface, reduces the number of  
system components.  
1.1.1  
Applications  
Electronic household appliances, office equipment, audio equipment, consumer equipment, etc.  
REJ03B0287-0100 Rev.1.00  
Mar 31, 2010  
Page 1 of 42  

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