Datasheet > R5F21326GJSP

R5F21326GJSP

更新时间： 2024-11-03 09:40:03

品牌	Logo	应用领域
瑞萨 - RENESAS		/
页数	文件大小	规格书
56页	506K
描述
Refer to Table 1.5 Product List for R8C/32G Group.

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R5F21326GJSP 数据手册

Preliminary Datasheet

Specifications in this document are tentative and subject to change.

R8C/32G Group, R8C/32H Group

RENESAS MCU

R01DS0026EJ0010

Rev.0.10

Feb 08, 2011

1. Overview

1.1

Features

The R8C/32G Group, R8C/32H Group of single-chip MCUs incorporates the R8C CPU core, employing

sophisticated instructions for a high level of efficiency. With 1 Mbyte of address space, and it is capable of

executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation

processing.

Power consumption is low, and the supported operating modes allow additional power control. These MCUs are

designed to maximize EMI/EMS performance.

Integration of many peripheral functions, including multifunction timer and serial interface, reduces the number of

system components.

The R8C/32G Group has data flash (1 KB × 4 blocks) with the background operation (BGO) function.

1.1.1

Applications

Automobiles and others

R01DS0026EJ0010 Rev.0.10

Feb 08, 2011

Page 1 of 53

12 3 4 5 6 7...56

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型号	品牌	获取价格	描述	数据表
R5F21326GKSP	RENESAS	获取价格	R5F21326GKSP
R5F21326HJSP	RENESAS	获取价格	Refer to Table 1.5 Product List for R8C/32G Group.
R5F21326HKSP	RENESAS	获取价格	Refer to Table 1.5 Product List for R8C/32G Group.
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