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R5F21332CNFP#X6 PDF预览

R5F21332CNFP#X6

更新时间: 2024-11-03 15:49:11
品牌 Logo 应用领域
瑞萨 - RENESAS 微控制器
页数 文件大小 规格书
56页 516K
描述
R5F21332CNFP#X6

R5F21332CNFP#X6 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:LQFP
针数:32Reach Compliance Code:compliant
风险等级:5.77位大小:16
CPU系列:R8CJESD-30 代码:S-PQFP-G32
端子数量:32最高工作温度:85 °C
最低工作温度:-20 °C封装主体材料:PLASTIC/EPOXY
封装代码:QFP封装等效代码:QFP32,.35SQ,32
封装形状:SQUARE封装形式:FLATPACK
电源:2/5 V认证状态:Not Qualified
RAM(字节):1024ROM(单词):8192
ROM可编程性:FLASH速度:20 MHz
子类别:Microcontrollers最大压摆率:15 mA
表面贴装:YES技术:CMOS
温度等级:OTHER端子形式:GULL WING
端子节距:0.8 mm端子位置:QUAD
Base Number Matches:1

R5F21332CNFP#X6 数据手册

 浏览型号R5F21332CNFP#X6的Datasheet PDF文件第2页浏览型号R5F21332CNFP#X6的Datasheet PDF文件第3页浏览型号R5F21332CNFP#X6的Datasheet PDF文件第4页浏览型号R5F21332CNFP#X6的Datasheet PDF文件第5页浏览型号R5F21332CNFP#X6的Datasheet PDF文件第6页浏览型号R5F21332CNFP#X6的Datasheet PDF文件第7页 
Datasheet  
R8C/33C Group  
RENESAS MCU  
R01DS0008EJ0100  
Rev 1.00  
Aug. 24, 2010  
1. Overview  
1.1  
Features  
The R8C/33C Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions  
for a high level of efficiency. With 1 Mbyte of address space, and it is capable of executing instructions at high  
speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.  
Power consumption is low, and the supported operating modes allow additional power control. These MCUs are  
designed to maximize EMI/EMS performance.  
Integration of many peripheral functions, including multifunction timer and serial interface, reduces the number of  
system components.  
The R8C/33C Group has data flash (1 KB × 4 blocks) with the background operation (BGO) function.  
1.1.1  
Applications  
Electronic household appliances, office equipment, audio equipment, consumer equipment, etc.  
R01DS0008EJ0100 Rev 1.00  
Aug. 24, 2010  
Page 1 of 53  

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