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R5F21331CNFP#30 PDF预览

R5F21331CNFP#30

更新时间: 2024-11-03 15:49:11
品牌 Logo 应用领域
瑞萨 - RENESAS 时钟外围集成电路
页数 文件大小 规格书
56页 516K
描述
R5F21331CNFP#30

R5F21331CNFP#30 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Contact Manufacturer零件包装代码:LQFP
包装说明:LQFP-32针数:32
Reach Compliance Code:compliantFactory Lead Time:20 weeks
风险等级:5.76具有ADC:YES
地址总线宽度:位大小:8
最大时钟频率:20 MHzDMA 通道:NO
外部数据总线宽度:长度:7 mm
I/O 线路数量:28端子数量:32
PWM 通道:YES封装代码:LQFP
封装形状:SQUARE封装形式:FLATPACK, LOW PROFILE
速度:20 MHz最大供电电压:5.5 V
最小供电电压:2.7 V标称供电电压:3 V
表面贴装:YES端子形式:GULL WING
端子节距:0.8 mm端子位置:QUAD
宽度:7 mmuPs/uCs/外围集成电路类型:MICROCONTROLLER
Base Number Matches:1

R5F21331CNFP#30 数据手册

 浏览型号R5F21331CNFP#30的Datasheet PDF文件第2页浏览型号R5F21331CNFP#30的Datasheet PDF文件第3页浏览型号R5F21331CNFP#30的Datasheet PDF文件第4页浏览型号R5F21331CNFP#30的Datasheet PDF文件第5页浏览型号R5F21331CNFP#30的Datasheet PDF文件第6页浏览型号R5F21331CNFP#30的Datasheet PDF文件第7页 
Datasheet  
R8C/33C Group  
RENESAS MCU  
R01DS0008EJ0100  
Rev 1.00  
Aug. 24, 2010  
1. Overview  
1.1  
Features  
The R8C/33C Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions  
for a high level of efficiency. With 1 Mbyte of address space, and it is capable of executing instructions at high  
speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.  
Power consumption is low, and the supported operating modes allow additional power control. These MCUs are  
designed to maximize EMI/EMS performance.  
Integration of many peripheral functions, including multifunction timer and serial interface, reduces the number of  
system components.  
The R8C/33C Group has data flash (1 KB × 4 blocks) with the background operation (BGO) function.  
1.1.1  
Applications  
Electronic household appliances, office equipment, audio equipment, consumer equipment, etc.  
R01DS0008EJ0100 Rev 1.00  
Aug. 24, 2010  
Page 1 of 53  

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