QSBT40
QUAD DATA LINE SCHOTTKY BUS TERMINATOR
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Features
Mechanical Data
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Low Forward Voltage Drop
Fast Switching
Very High Density
Ultra-Small Surface Mount Package PN Junction Guard Ring
for Transient and ESD Protection
Provide Transient Protection for High-Speed Data Lines in
Accordance With:
IEC61000-4-2 (ESD) 15kV (Air), 8kV (Contact)
IEC61000-4-4 (EFT) 80A (tp = 5/50 ns)
IEC61000-4-5 (Lightning) Class 3
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Case: SOT-363
Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020D
Terminals: Lead Free Plating (Matte Tin Finish annealed over
Alloy 42 leadframe). Solderable per MIL-STD-202, Method 208
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Polarity: See Diagram
Marking Information: See Page 2
Ordering Information: See Page 2
Weight: 0.006 grams (approximate)
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Lead Free/RoHS Compliant (Note 2)
"Green" Device (Note 3 and 4)
VCC
DL2
DL1
DL4 GND
DL3
Top View
Device Schematic
Maximum Ratings @T = 25°C unless otherwise specified
A
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitance load, derate current by 20%.
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Symbol
VRRM
VRWM
VR
Value
Unit
30
V
Forward Continuous Current
(Note 1)
200
600
mA
mA
IFM
Non-Repetitive Peak Forward Surge Current
@ t < 1.0s
IFSM
Thermal Characteristics
Characteristic
Symbol
PD
Value
200
Unit
mW
Power Dissipation
(Note 1)
(Note 1)
Thermal Resistance Junction to Ambient Air
Operating Temperature Range
Storage Temperature Range
625
°C/W
°C
°C
Rθ
JA
-55 to +125
-65 to +125
TJ
TSTG
Electrical Characteristics @T = 25°C unless otherwise specified
A
Characteristic
Reverse Breakdown Voltage
Symbol Min
Typ
Max
Unit Test Condition
IR = 100μA
(Note 5)
30
V(BR)R
⎯
V
⎯
IF = 0.1mA, tp < 300µS
IF = 1.0mA, tp < 300µS
IF = 10mA, tp < 300µS
IF = 30mA, tp < 300µS
IF = 100mA, tp < 300µS
280
350
450
550
1000
Forward Voltage
VF
⎯
⎯
⎯
mV
Reverse Current
(Note 5)
2
IR
⎯
⎯
μA
VR = 25V
VR = 0, f = 1.0MH (Note 6)
VR = 0, f = 1.0MHZ (Note 7)
10.0
6.5
Total Capacitance
pF
CT
⎯
IF = IR = 10mA,
Irr = 0.1 x IR, RL = 100Ω
Reverse Recovery Time
5.0
ns
trr
⎯
⎯
Notes:
1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which
can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. No purposefully added lead.
3. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
4. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
5. Short duration pulse test used to minimize self-heating effect.
6. At VR = 0V, DL(X) to VCC or GND.
7. At VR = 0V, between Data Lines (e.g., DL1 and DL4).
1 of 3
www.diodes.com
May 2008
© Diodes Incorporated
QSBT40
Document number: DS30195 Rev. 15 - 2