SPICE MODEL: QSBT40
QSBT40
QUAD DATA LINE SCHOTTKY BUS TERMINATOR
Lead-free
Features
·
·
·
·
Low Forward Voltage Drop
Fast Switching
A
SOT-363
Very High Density
Ultra-Small Surface Mount Package PN Junction Guard Ring
for Transient and ESD Protection
Dim
A
Min
0.10
1.15
2.00
Max
0.30
1.35
2.20
B
C
TOP VIEW
·
Provide transient protection for high-speed data lines in
accordance with:
IEC61000-4-2 (ESD) 15kV (Air), 8kV (Contact)
IEC61000-4-4 (EFT) 80A (tp = 5/50 ns)
IEC61000-4-5 (Lightning) Class 3
B
C
G
H
D
0.65 Nominal
F
0.30
1.80
¾
0.40
2.20
0.10
1.00
0.40
0.25
8°
·
Lead Free/RoHS Compliant (Note 5)
K
J
M
H
Mechanical Data
·
J
L
D
F
K
Case: SOT-363
0.90
0.25
0.10
0°
·
Case material: Molded Plastic. UL Flammability
Classification Rating 94V-0
VCC
L
DL2
DL1
M
·
·
·
Moisture Sensitivity: Level 1 per J-STD-020C
a
Terminals: Solderable per MIL-STD-202, Method 208
All Dimensions in mm
Lead Free Plating (Matte Tin Finish annealed over Alloy 42
leadframe). Please See Ordering Information, Note 7, on
Page 2
·
·
·
Polarity: See Diagram
DL4 GND
DL3
Marking Code: KST (See Page 2)
Weight: 0.006 grams (approx.)
@ TA = 25°C unless otherwise specified
Maximum Ratings
Characteristic
Symbol
Value
Unit
VRRM
VRWM
VR
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
30
V
IFM
IFSM
Pd
200
600
mA
mA
mW
°C/W
°C
Forward Continuous Current (Note 1)
Non-Repetitive Peak Forward Surge Current @ t < 1.0s
Power Dissipation (Note 1)
200
RqJA
Tj
Thermal Resistance Junction to Ambient Air (Note 1)
Operating Temperature Range
625
-55 to +125
-65 to +125
TSTG
Storage Temperature Range
°C
@ TA = 25°C unless otherwise specified
Electrical Characteristics
Characteristic
Symbol Min
Typ
Max
Unit
Test Condition
V(BR)R
30
Reverse Breakdown Voltage (Note 2)
V
IR = 100mA
¾
¾
280
350
IF = 0.1mA, tp < 300µS
IF = 1.0mA, tp < 300µS
IF = 10mA, tp < 300µS
IF = 30mA, tp < 300µS
IF = 100mA, tp < 300µS
VF
Forward Voltage
450
mV
¾
¾
¾
550
1000
VR = 25V
IR
Reverse Current (Note 2)
Total Capacitance
¾
2
mA
VR = 0, f = 1.0MHz (Note 3)
10.0
6.5
CT
¾
¾
pF
V
R = 0, f = 1.0MHZ (Note 4)
IF = IR = 10mA,
Irr = 0.1 x IR, RL = 100W
trr
Reverse Recovery Time
¾
¾
5.0
ns
Notes: 1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout
document AP02001, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. Short duration test pulse used to minimize self-heating effect.
3. At V = 0V, DL(X) to V
or GND.
CC
R
4. At V = 0V, between Data Lines (e.g., DL1 and DL4).
R
5. No purposefully added lead.
DS30195 Rev. 12 - 2
1 of 3
QSBT40
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