QS8004xHx
Thyristor Datasheet
Fig. 11.Test Circuit for Inductive and Resistive Loads with Conditions Equivalent to IEC 61000-4-5
IEC 61000-4-5 Standards
Surge Generator
R
2
Gen
Filtering Unit
L
R
2
H
23
R
G
DUT
Load Model
AC Mains
220
Soldering Parameters
tP
Reflow Condition
Pb – Free assembly
150°C
TP
-Temperature Min (Ts(min)
)
Ramp-up
Pre Heat
-Temperature Max (Ts(max)
)
200°C
TL
TS(max)
-Time (min to max) (ts)
60 – 120 seconds
tL
Average ramp up rate (LiquidusTemp) (TL) to
peak
3°C/second max.
Ramp-down
Preheat
TS(max) toTL - Ramp-up Rate
3°C/second max.
217°C
-Temperature (TL) (Liquidus)
TS(min)
Reflow
tS
-Time (tL)
60 – 150 seconds
260+0/-5 °C
PeakTemperature (TP)
25
Time within 5°C of actual peakTemperature (tp)
Ramp-down Rate
30 seconds max.
6°C/second max.
8 minutes max.
260°C
time to peak temperature
Time
Time 25°C to peakTemperature (TP)
Do not exceed
Physical Specifications
Environmental Specifications
Test
Specifications and Conditions
Terminal Finish
Body Material
100% MatteTin-plated
UL recognized compound meeting flammability
rating 94 V-0
Copper Alloy
MIL-STD-750, M-1040, Cond A Applied
Peak AC voltage @ 125°C for 1008 hours
MIL-STD-750, M-1051,1000 cycles; -55°C
to +150°C; 15-min dwell-time
AC Blocking
Terminal Material
Temperature Cycling
EIA / JEDEC, JESD22-A101; 1008 hours;
320V - DC: 85°C; 85% rel humidity
Temperature/Humidity
Design Considerations
High-temp Storage
Low-temp Storage
MIL-STD-750, M-1031, 1008 hours; 150°C
1008 hours; -40°C
Careful selection of the correct component for the application’s
operating parameters and environment will go a long way toward
extending the operating life of the Thyristor. Good design practice
should limit the maximum continuous current through the main
terminals to 75% of the component rating. Other ways to ensure long
life for a power discrete semiconductor are proper heat sinking and
selection of voltage ratings for worst case conditions. Overheating,
overvoltage (including dv/dt), and surge currents are the main killers of
semiconductors. Correct mounting, soldering, and forming of the leads
also help protect against component damage.
Resistance to Solder Heat
Solderability
MIL-STD-750 Method 2031
ANSI/J-STD-002, category 3, Test A
MSL Level 1
Moisture Sensitivity Level
© 2023 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: TK.06/15/2023
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