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Q67050-A4330-A101 PDF预览

Q67050-A4330-A101

更新时间: 2024-01-24 12:17:05
品牌 Logo 应用领域
英飞凌 - INFINEON 双极性晶体管
页数 文件大小 规格书
4页 77K
描述
IGBT3 Chip

Q67050-A4330-A101 数据手册

 浏览型号Q67050-A4330-A101的Datasheet PDF文件第2页浏览型号Q67050-A4330-A101的Datasheet PDF文件第3页浏览型号Q67050-A4330-A101的Datasheet PDF文件第4页 
SIGC04T60  
IGBT3 Chip  
FEATURES:  
This chip is used for:  
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600V Trench & Field Stop technology  
low VCE(sat)  
low turn-off losses  
short tail current  
positive temperature coefficient  
easy paralleling  
C
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power module  
discrete components  
Applications:  
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drives  
white goods  
resonant applications  
G
E
Chip Type  
SIGC04T60  
VCE  
ICn  
6A  
Die Size  
Package  
sawn on foil  
Ordering Code  
Q67050-  
A4330-A101  
600V  
1.98 x 1.96 mm2  
MECHANICAL PARAMETER:  
Raster size  
1.98 x 1.96  
Emitter pad size  
Gate pad size  
1.254 x 1.273  
mm2  
0.266 x 0.266  
Area total / active  
Thickness  
3.9 / 2.14  
mm2  
µm  
70  
150  
0
Wafer size  
mm  
deg  
Flat position  
Max. possible chips per wafer  
Passivation frontside  
Emitter metallization  
3779 pcs  
Photoimide  
3200 nm AlSiCu  
1400 nm Ni Ag –system  
suitable for epoxy and soft solder die bonding  
Collector metallization  
Die bond  
electrically conductive glue or solder  
Wire bond  
Al, <500µm  
Reject ink dot size  
Æ 0.65mm ; max 1.2mm  
store in original container, in dry nitrogen,  
< 6 month at an ambient temperature of 23°C  
Recommended storage environment  
Edited by INFINEON Technologies AI PS DD CLS, L7491A, Edition 2, 27.01.2005