PP4515BL
N-Channel Enhancement Mode
Field Effect Transistor
NIKO-SEM
SOT-223
Halogen-Free & Lead-Free
PRODUCT SUMMARY
D
V(BR)DSS
150V
RDS(ON)
ID
5.5A
48mΩ
G
1. GATE
2. DRAIN
3. SOURCE
S
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C Unless Otherwise Noted)
PARAMETERS/TEST CONDITIONS
Gate-Source Voltage
SYMBOL
LIMITS
±20
UNITS
VGS
V
TA = 25 °C
TA = 70 °C
5.5
Continuous Drain Current
ID
4.4
A
Pulsed Drain Current1
Avalanche Current
Avalanche Energy
IDM
IAS
23
14
L = 1mH
EAS
74
mJ
TA = 25 °C
TA = 70 °C
3.5
Power Dissipation3
PD
W
2.2
Operating Junction & Storage Temperature Range
Tj, Tstg
-55 to 150
°C
THERMAL RESISTANCE RATINGS
THERMAL RESISTANCE
SYMBOL
TYPICAL
MAXIMUM
UNITS
°C / W
Junction-to-Ambient2
35
52
t ≦10s
RJA
RJA
Junction-to-Ambient2
Steady-State
1Pulse width limited by maximum junction temperature.
2The value of RθJA is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air
environment with TA =25°C.
3The Power dissipation is based on RJA t ≦10s value.
ELECTRICAL CHARACTERISTICS (TJ = 25 °C, Unless Otherwise Noted)
LIMITS
MIN TYP MAX
PARAMETER
SYMBOL
TEST CONDITIONS
STATIC
UNIT
Drain-Source Breakdown Voltage
Gate Threshold Voltage
Gate-Body Leakage
V(BR)DSS
VGS(th)
IGSS
150
VGS = 0V, ID = 250A
VDS = VGS, ID = 250A
V
1
2.1
3
VDS = 0V, VGS = ±20V
±100 nA
VDS = 150V, VGS = 0V
1
Zero Gate Voltage Drain Current
IDSS
A
VDS = 150V, VGS = 0V, TJ = 55 °C
10
REV1.1
N-34-3
1