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PHN210T/T3 PDF预览

PHN210T/T3

更新时间: 2024-11-29 15:47:51
品牌 Logo 应用领域
恩智浦 - NXP 开关脉冲光电二极管晶体管
页数 文件大小 规格书
13页 313K
描述
TRANSISTOR 3.4 A, 30 V, 0.1 ohm, 2 CHANNEL, N-CHANNEL, Si, POWER, MOSFET, MS-012AA, PLASTIC, SOP-8, FET General Purpose Power

PHN210T/T3 技术参数

是否无铅:不含铅是否Rohs认证:符合
生命周期:Transferred零件包装代码:SOIC
包装说明:PLASTIC, SOP-8针数:8
Reach Compliance Code:unknownECCN代码:EAR99
风险等级:5.13Is Samacsys:N
其他特性:LOGIC LEVEL COMPATIBLE雪崩能效等级(Eas):13 mJ
配置:SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE最小漏源击穿电压:30 V
最大漏极电流 (ID):3.4 A最大漏源导通电阻:0.1 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:MS-012AA
JESD-30 代码:R-PDSO-G8元件数量:2
端子数量:8工作模式:ENHANCEMENT MODE
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大脉冲漏极电流 (IDM):14 A
认证状态:Not Qualified表面贴装:YES
端子形式:GULL WING端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

PHN210T/T3 数据手册

 浏览型号PHN210T/T3的Datasheet PDF文件第2页浏览型号PHN210T/T3的Datasheet PDF文件第3页浏览型号PHN210T/T3的Datasheet PDF文件第4页浏览型号PHN210T/T3的Datasheet PDF文件第5页浏览型号PHN210T/T3的Datasheet PDF文件第6页浏览型号PHN210T/T3的Datasheet PDF文件第7页 
PHN210T  
Dual N-channel TrenchMOS intermediate level FET  
Rev. 02 — 15 December 2010  
Product data sheet  
1. Product profile  
1.1 General description  
Dual intermediate level N-channel enhancement mode Field-Effect Transistor (FET) in a  
plastic package using TrenchMOS technology. This product is designed and qualified for  
use in computing, communications, consumer and industrial applications only.  
1.2 Features and benefits  
Suitable for high frequency  
applications due to fast switching  
characteristics  
Suitable for logic level gate drive  
sources  
Suitable for low gate drive sources  
1.3 Applications  
DC-to-DC converters  
Logic level translators  
Motor and relay drivers  
1.4 Quick reference data  
Table 1.  
Symbol  
VDS  
Quick reference data  
Parameter  
Conditions  
Min Typ Max Unit  
drain-source  
voltage  
Tj 25 °C; Tj 150 °C;  
Repetitive peak drain-source  
voltage  
-
-
30  
V
[1]  
[2]  
ID  
drain current  
Tsp = 25 °C; Single device  
Tsp = 25 °C  
-
-
-
-
3.4  
2
A
Ptot  
total power  
dissipation  
W
Static characteristics  
RDSon drain-source  
VGS = 4.5 V; ID = 1 A;  
Tj = 25 °C  
-
-
120 200 mΩ  
on-state  
resistance  
VGS = 10 V; ID = 2.2 A;  
Tj = 25 °C  
80  
100 mΩ  
Dynamic characteristics  
QGD  
gate-drain charge VGS = 10 V; ID = 2.3 A;  
VDS = 15 V; Tj = 25 °C  
-
0.7  
-
nC  
[1] Surface mounted on FR4 board, t 10 sec.  
[2] Surface mounted on FR4, t 10 sec.  

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