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NUF4001MU PDF预览

NUF4001MU

更新时间: 2024-09-09 03:45:47
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
4页 52K
描述
Low Capacitance 4 Line EMI Filter with ESD Protection in UDFN8 Package

NUF4001MU 数据手册

 浏览型号NUF4001MU的Datasheet PDF文件第2页浏览型号NUF4001MU的Datasheet PDF文件第3页浏览型号NUF4001MU的Datasheet PDF文件第4页 
NUF4001MU  
Low Capacitance  
4 Line EMI Filter with  
ESD Protection in UDFN8  
Package  
http://onsemi.com  
This device is a 4 line EMI filter array for wireless applications.  
Greater than −25 dB attenuation is obtained at frequencies from  
800 MHz to 5.0 GHz. The NUF4001MU has a cut−off frequency of  
150 MHz and can be used in applications for data rate up to 58 MHz or  
116 Mbps. This UDFN package is specifically designed to enhance  
EMI filtering for low−profile or slim design electronics especially  
where space and height is a premium. It also offers ESD  
protection−clamping transients from static discharges. ESD protection  
is provided across all capacitors.  
1
2
3
4
8
7
6
5
Cd Cd  
Cd Cd  
Cd Cd  
Features  
EMI Filtering and ESD Protection  
Integration of 20 Discrete Components  
Cd Cd  
Compliance with IEC61000−4−2 (Level 4)  
>14 kV (Contact)  
(Top View)  
>15 kV (Air)  
UDFN Package, 1.2 x 1.8 mm  
MARKING  
DIAGRAM  
8
Moisture Sensitivity Level 1  
1
ESD Ratings: Machine Model = C  
1
41 MG  
Human Body Model = 3B  
UDFN8  
G
CASE 517AD  
This is a Pb−Free Device*  
Benefits  
41  
M
G
= Specific Device Code  
= Month Code  
= Pb−Free Package  
Reduces EMI/RFI Emmisions on a Data Line  
Low Profile Package; Typical Height of 0.5 mm  
Design−Friendly and Easy−to−Use Pin Configurations,  
Particularly for Portable Electronics  
(Note: Microdot may be in either location)  
PIN CONNECTIONS  
Integrated Solution Offers Cost and Space Savings in UDFN Package  
Reduces Parasitic Inductances Which Offer a More “Ideal” Low Pass  
Filter Response  
1
4
Integrated Solution Improves System Reliability  
Applications  
EMI Filtering and ESD Protection for Data Lines  
Keypad Interface and Protection for Portable Electronics  
Bottom Connector Interface for Mobile Handsets  
Notebook Computers and Digital Cameras  
LCD Display Interface in Mobile Handsets  
Camera Display Interface in Mobile Handsets  
8
5
ORDERING INFORMATION  
Device  
Package  
Shipping  
NUF4001MUT2G  
UDFN8  
3000 / Tape & Reel  
(Pb−Free)  
*For additional information on our Pb−Free strategy and soldering details, please  
download the ON Semiconductor Soldering and Mounting Techniques  
Reference Manual, SOLDERRM/D.  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
©
Semiconductor Components Industries, LLC, 2006  
1
Publication Order Number:  
December, 2006 − Rev. 1  
NUF4001MU/D  

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