NUF4001MU
Low Capacitance
4 Line EMI Filter with
ESD Protection in UDFN8
Package
http://onsemi.com
This device is a 4 line EMI filter array for wireless applications.
Greater than −25 dB attenuation is obtained at frequencies from
800 MHz to 5.0 GHz. The NUF4001MU has a cut−off frequency of
150 MHz and can be used in applications for data rate up to 58 MHz or
116 Mbps. This UDFN package is specifically designed to enhance
EMI filtering for low−profile or slim design electronics especially
where space and height is a premium. It also offers ESD
protection−clamping transients from static discharges. ESD protection
is provided across all capacitors.
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Cd Cd
Cd Cd
Cd Cd
Features
• EMI Filtering and ESD Protection
• Integration of 20 Discrete Components
Cd Cd
• Compliance with IEC61000−4−2 (Level 4)
>14 kV (Contact)
(Top View)
>15 kV (Air)
• UDFN Package, 1.2 x 1.8 mm
MARKING
DIAGRAM
8
• Moisture Sensitivity Level 1
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• ESD Ratings: Machine Model = C
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41 MG
Human Body Model = 3B
UDFN8
G
CASE 517AD
• This is a Pb−Free Device*
Benefits
41
M
G
= Specific Device Code
= Month Code
= Pb−Free Package
• Reduces EMI/RFI Emmisions on a Data Line
• Low Profile Package; Typical Height of 0.5 mm
• Design−Friendly and Easy−to−Use Pin Configurations,
Particularly for Portable Electronics
(Note: Microdot may be in either location)
PIN CONNECTIONS
• Integrated Solution Offers Cost and Space Savings in UDFN Package
• Reduces Parasitic Inductances Which Offer a More “Ideal” Low Pass
Filter Response
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4
• Integrated Solution Improves System Reliability
Applications
• EMI Filtering and ESD Protection for Data Lines
• Keypad Interface and Protection for Portable Electronics
• Bottom Connector Interface for Mobile Handsets
• Notebook Computers and Digital Cameras
• LCD Display Interface in Mobile Handsets
• Camera Display Interface in Mobile Handsets
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ORDERING INFORMATION
†
Device
Package
Shipping
NUF4001MUT2G
UDFN8
3000 / Tape & Reel
(Pb−Free)
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
©
Semiconductor Components Industries, LLC, 2006
1
Publication Order Number:
December, 2006 − Rev. 1
NUF4001MU/D