NUF4310MN
Low Capacitance 4-Line
EMI Filter with ESD
Protection in WDFN8
Package
http://onsemi.com
This device is a 4 line EMI filter array for wireless applications.
Greater than −25 dB attenuation is obtained at frequencies from
800 MHz to 4.0 GHz. The NUF4310MN has a cut−off frequency of
185 MHz. This WDFN package is specifically designed to enhance
EMI filtering for low−profile or slim design electronics especially
where space and height is a premium. It also offers ESD
protection−clamping transients from static discharges. ESD protection
is provided across all capacitors.
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Cd Cd
Cd Cd
Cd Cd
Features
• EMI Filtering and ESD Protection
• Integration of 20 Discrete Components
• Compliance with IEC61000−4−2 (Level 4)
>8 kV (Contact) [I/O Pins to GND]
• WDFN Package, 1.6 x 1.0 mm
• Moisture Sensitivity Level 1
Cd Cd
(Top View)
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MARKING
DIAGRAM
• ESD Ratings: Machine Model = C
Human Body Model = 3B
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• This is a Pb−Free Device*
Benefits
43MG
WDFN8
G
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CASE 511AF
• Reduces EMI/RFI Emissions on a Data Line
• Low Profile Package; Typical Height of 0.75 mm
43 = Specific Device Code
M = Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
• Design−Friendly and Easy−to−Use Pin Configurations,
Particularly for Portable Electronics
• Integrated Solution Offers Cost and Space Savings in WDFN
Package
PIN CONNECTIONS
• Reduces Parasitic Inductances Which Offer a More “Ideal” Low Pass
Filter Response
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• Integrated Solution Improves System Reliability
Applications
• EMI Filtering and ESD Protection for Data Lines
• Keypad Interface and Protection for Portable Electronics
• Bottom Connector Interface for Mobile Handsets
• Notebook Computers and Digital Cameras
• LCD Display Interface in Mobile Handsets
• Camera Display Interface in Mobile Handsets
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ORDERING INFORMATION
†
Device
Package
Shipping
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
NUF4310MNTAG
WDFN8
(Pb−Free)
3000 / Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2008
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Publication Order Number:
October, 2008 − Rev. 0
NUF4310MN/D