NUF4107FC
Four Channel EMI Pi−Filter
Array with Full USB Filter
This device is a four−channel EMI filter array for data lines. Greater
than −35 dB attenuation is obtained at frequencies from 800 MHz to
2.2 GHz. It also offers USB filtering circuitry with speed detection.
This includes the inline resistors for impedance matching and EMI
filtering. ESD protection is provided across all capacitors.
http://onsemi.com
CIRCUIT DESCRIPTION
Features
R
R
R
R
R
R
1
2
3
A1
A2
A3
A4
A5
A6
• EMI Filtering and ESD Protection for Data Lines
• USB 1.1 Filtering Provided with Speed Detection
• Integration of 27 Discretes Offers Cost and Space Savings
• 350 mm Solder Spheres
C1
C2
C3
C4
C5
C6
C
1
2
3
D
D
D
D
D
1
2
R
7
B
1
C
• All TVS Protected Inputs Comply with IEC61000−4−2 (Level 4)
30 kV (Contact)
30 kV (Air)
B
2
D
11
• Low Profile Flip−Chip Packaging
• MSL 1
• All Pins Exceed 2000 V Human Body Model (Note 1)
• Pb−Free Package is Available*
C
C
4
3
5
7
D
4
6
8
B
3
4
5
6
C
C
C
5
6
8
Typical Applications
D
D
• EMI and USB Filtering and ESD Protection for Data Lines
• Cell Phones
B
4
• Handheld Portables
C
7
• Notebook Computers
B
5
• MP3 Players
MAXIMUM RATINGS (T = 25°C)
A
D
C
9
C
9
10
D
10
Rating
Symbol
Value
Unit
ESD Discharge IEC61000−4−2 (Note 1)
− Air Discharge, Contact Discharge
Human Body Model
V
PP
kV
30
16
0.4
FLIP−CHIP−17
CASE 499AD
Machine Model
A1
DC Power per Resistor
P
100
600
mW
mW
°C
R
MARKING DIAGRAM
DC Power per Package
Junction Temperature
P
T
J
4107
A
Y
= Device Code
= Assembly Location
= Year
= Work Week
= Pb−Free Package
T
150
4107AYWW G
Operating Temperature Range
Storage Temperature Range
T
op
−40 to +85
−55 to +150
°C
G
WW
G
T
stg
°C
(Note: Microdot may be in either location)
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. This does not include Pins B1, C1 and C2
ORDERING INFORMATION
Device
Package
Shipping†
NUF4107FCT1
Flip−Chip 3000 Tape & Reel
NUF4107FCT1G
Flip−Chip 3000 Tape & Reel
(Pb−Free)
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2006
1
Publication Order Number:
March, 2006 − Rev. 3
NUF4107FC/D