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NUF4107FC

更新时间： 2024-09-08 21:55:11
品牌 Logo 应用领域
安森美 - ONSEMI 过滤器
页数 文件大小 规格书
6页 53K
描述
4 Channel EMI Pi-Filter Array with Full USB Filter

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中文翻译

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NUF4107FC 数据手册

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NUF4107FC  
4 Channel EMI Pi−Filter  
Array with Full USB Filter  
This device is a 4 channel EMI filter array for data lines. Greater  
than −35 dB attenuation is obtained at frequencies from 800 MHz to  
2.2 GHz. It also offers USB filtering circuitry with speed detection.  
This includes the inline resistors for impedance matching and EMI  
filtering. ESD protection is provided across all capacitors.  
http://onsemi.com  
CIRCUIT DESCRIPTION  
Features  
R
R
R
R
R
R
1
2
3
4
• EMI Filtering and ESD Protection for Data Lines  
• USB 1.1 Filtering Provided with Speed Detection  
• Integration of 27 Discretes Offers Cost and Space Savings  
• Pb−Free Package May be Available. The G−Suffix Denotes a  
Pb−Free Lead Finish  
A1  
A2  
A3  
A4  
A5  
A6  
C1  
C2  
C3  
C4  
C5  
C6  
C
1
2
3
D
D
D
D
D
1
2
R
7
B
1
C
• 350 mm Solder Spheres  
• All TVS Protected Inputs Comply with IEC61000−4−2 (Level 4)  
B
2
D
11  
30 kV (Contact)  
30 kV (Air)  
C
C
4
3
5
7
D
4
6
8
• Low Profile Flip−Chip Packaging  
• MSL 1  
• All Pins Exceed 2000 Volts Human Body Model  
Typical Applications  
B
3
C
C
C
5
6
8
D
D
• EMI and USB Filtering and ESD Protection for Data Lines  
• Cell Phones  
• Handheld Portables  
• Notebook Computers  
• MP3 Players  
B
4
5
6
C
7
B
5
MAXIMUM RATINGS (T = 25°C)  
A
D
C
9
C
9
10  
D
10  
Rating  
Symbol  
Value  
Unit  
ESD Discharge IEC61000−4−2 (Note 1)  
− Air Discharge, Contact Discharge  
Human Body Model  
V
PP  
kV  
30  
16  
FLIP−CHIP−17  
CASE 499AD  
Machine Model  
0.4  
DC Power per Resistor  
P
100  
600  
mW  
mW  
°C  
R
A1  
DC Power per Package  
P
T
Junction Temperature  
T
150  
J
DEVICE MARKING  
Operating Temperature Range  
Storage Temperature Range  
1. This does not include Pins B1, C1 and C2  
T
op  
−40 to +85  
−55 to +150  
°C  
T
stg  
°C  
NUF4107  
ORDERING INFORMATION  
Device  
NUF4107FCT1G  
Package  
Shipping†  
Flip−Chip 3000/Tape & Reel  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
Semiconductor Components Industries, LLC, 2004  
1
Publication Order Number:  
April, 2004 − Rev. 0  
NUF4107FC/D  
 
123456

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