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NTP5860N PDF预览

NTP5860N

更新时间: 2024-11-23 12:22:51
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
7页 123K
描述
N-Channel Power MOSFET

NTP5860N 技术参数

生命周期:Active零件包装代码:TO-220AB
包装说明:LEAD FREE, CASE 418B-04, D2PAK-3针数:3
Reach Compliance Code:compliantECCN代码:EAR99
风险等级:5.23雪崩能效等级(Eas):800 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:60 V最大漏极电流 (ID):103 A
最大漏源导通电阻:0.003 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-220ABJESD-30 代码:R-PSFM-T3
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:FLANGE MOUNT
极性/信道类型:N-CHANNEL最大脉冲漏极电流 (IDM):520 A
表面贴装:NO端子形式:THROUGH-HOLE
端子位置:SINGLE晶体管元件材料:SILICON
Base Number Matches:1

NTP5860N 数据手册

 浏览型号NTP5860N的Datasheet PDF文件第2页浏览型号NTP5860N的Datasheet PDF文件第3页浏览型号NTP5860N的Datasheet PDF文件第4页浏览型号NTP5860N的Datasheet PDF文件第5页浏览型号NTP5860N的Datasheet PDF文件第6页浏览型号NTP5860N的Datasheet PDF文件第7页 
NTB5860N, NTP5860N,  
NVB5860N  
N-Channel Power MOSFET  
60 V, 220 A, 3.0 mW  
Features  
http://onsemi.com  
Low R  
DS(on)  
High Current Capability  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(on)  
100% Avalanche Tested  
These Devices are PbFree, Halogen Free and are RoHS Compliant  
60 V  
3.0 mW @ 10 V  
220 A  
NVB Prefix for Automotive and Other Applications Requiring  
Unique Site and Control Change Requirements; AECQ101  
Qualified and PPAP Capable  
D
MAXIMUM RATINGS (T = 25°C Unless otherwise specified)  
J
G
Parameter  
DraintoSource Voltage  
GatetoSource Voltage Continuous  
Symbol  
Value  
60  
Unit  
V
V
DSS  
S
NCHANNEL MOSFET  
V
GS  
$20  
220  
156  
283  
V
4
Continuous Drain  
Current, R  
Steady  
State  
T
= 25°C  
= 100°C  
= 25°C  
I
D
A
C
q
JC  
T
C
4
Power Dissipation,  
R
Steady  
State  
T
C
P
D
W
q
JC  
1
2
Pulsed Drain Current  
t = 10 ms  
p
I
660  
130  
A
A
DM  
3
2
Current Limited by Package  
I
DMmax  
TO220AB  
D PAK  
CASE 221A  
STYLE 5  
CASE 418B  
STYLE 2  
1
Operating and Storage Temperature Range  
T , T  
55 to  
+175  
°C  
J
stg  
2
3
Source Current (Body Diode)  
I
130  
735  
A
S
MARKING DIAGRAMS  
& PIN ASSIGNMENTS  
Single Pulse DraintoSource Avalanche  
Energy (L = 0.3 mH)  
E
AS  
mJ  
4
4
Drain  
Lead Temperature for Soldering  
Purposes (1/8from Case for 10 Seconds)  
T
260  
°C  
L
Drain  
THERMAL RESISTANCE RATINGS  
Parameter  
NTB  
5860NG  
AYWW  
Symbol  
Max  
0.53  
28  
Unit  
NTP  
5860NG  
AYWW  
JunctiontoCase (Drain) Steady State  
JunctiontoAmbient Steady State (Note 1)  
R
°C/W  
q
JC  
R
2
q
JA  
1
Gate  
3
1
Gate  
3
Drain  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
1. Surface mounted on FR4 board using 1 sq in pad size,  
Source  
Source  
2
Drain  
G
A
Y
= PbFree Device  
= Assembly Location*  
= Year  
(Cu Area 1.127 sq in [2 oz] including traces).  
WW = Work Week  
*Could be one or two digit alpha or numeric code  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 5 of this data sheet.  
© Semiconductor Components Industries, LLC, 2012  
1
Publication Order Number:  
September, 2012 Rev. 2  
NTB5860N/D  
 

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